Alpha Assembly Solutions to Feature Void Reduction, Low-Temp Tech at IPC APEX EXPO 2018


Reading time ( words)

Alpha Assembly Solutions will feature its latest low temperature solder and void reduction solutions technologies at the upcoming IPC APEX EXPO 2018 trade show in San Diego, California. Alpha will be at Booth 727.

Alpha's recently launched low temperature solder paste, ALPHA OM-550, will be the focus among its Low Temperature Solder Solutions. "OM-550 provides another low temperature solution to customers looking for SAC305-type mechanical and thermal reliability in a low temperature alloy," said Robert Wallace, Regional Marketing Manager for the Americas. "This is a first rate paste that provides customers with efficiencies in both energy and cost while improving BGA mechanical reliability compared to other low temp alloys."

Alpha's void reduction solutions technology combines several of Alpha’s innovative products and assembly processes. "Alpha has developed a reliable low void technology system for bottom terminated components which has shown to dramatically decrease voiding," said Jerry Sidone, Product Manager for Engineered Materials at Alpha Assembly Solutions. "We will discuss this technology and provide data that addresses the challenges of voiding and managing thermal reliability in the paper presentation, Novel Approach to Void Reduction Using Microflux Coated Solder Preforms for QFN/BTC Packages that Generate Heat."

The paper will be delivered on Tuesday, February 27 at the Bottom Terminated Components Session from 1:30–3:00 pm.

Alpha will be co-exhibiting in Booth #727 with MacDermid Enthone Electronics Solutions. Both companies are a part of the MacDermid Performance Solutions group of businesses. Please visit us there.

About MacDermid Performance Solutions

MacDermid Performance Solutions Business group of businesses supply innovative, functional products to a rapidly changing electronics marketplace. We research, develop and deliver specialty substrates and high performance environmental friendly materials that enable the manufacture of complex electronic circuits and assemblies. For more information, visit http://www.macdermid.com/.

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.

For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications. 

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials.  For more information, click here.

Share


Suggested Items

Under the Hood: Solder Joint Reliability

05/21/2018 | Burton Carpenter, NXP Semiconductors Inc.
It has been long established that packages using NSMD BGA pads were more resilient than ones with SMD pads to fatigue-induced solder joint cracks. However, NSMD pads in previous investigations on 292MAPBGA and 416PBGA packages failed sooner in AATS testing due to an alternate failure mode: substrate Cu trace cracks. This article looks into the effects of substrate material and package pad design on solder joint reliability of 0.8 mm pitch BGA.

Solving Reliability and Thermal Management Challenges in Automotive Electronics

05/01/2018 | Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.



Copyright © 2018 I-Connect007. All rights reserved.