-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
TRI to Feature Revolutionary AOI at IPC APEX EXPO 2018
January 22, 2018 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI) will join IPC APEX EXPO 2018 held at San Diego Convention Center on February 27th - March 1st featuring innovative one-stop inspection solution for Industry 4.0-based PCBA manufacturing. Visit booth #1317 to see TRI's all new 3D SPI, 3D AOI, 3D Planar CT AXI and ICT solutions in action and discuss your inspection requirements with TRI's experts.
Planar CT X-Ray
Planar Computed Tomography (CT) X-Ray inspects effectively PCBAs layer by layer without in not invasive way achieving unbeatable inspection depth. Recommended for the inspection of solder volume, double-sided multilayer-boards and defects such as head-in-pillow.
TRI's VP of Sales and Marketing Jim Lin commented on the occasion, "We are honored to announce TRI’s innovative Depth from Focus 3D AOI technology. TRI’s cutting-edge TR7700Q DFF 3D AOI guarantees 1µm ultra-high resolution and 01005in chips. We are eager to share TRI’s innovations with our partners and the rest of the SMT Industry.”
TRI is eager to showcase the revolutionary TR7700Q 3D AOI with Depth from Focus (DFF) module and stop-and-go technology to optimize the inspection of complex PCBs, delivering high speed, high accuracy and high reliability testing.
Depth from Focus
Depth of Focus (DFF) is a revolutionary 3D sensing technique that searches for the optimal focus position and measures the depth of the image. The DFF algorithm will create 3D model of the component and its surroundings.
TRI’s portfolio for IPC APEX EXPO 2018 will include the Global Technology Award-winning TR7007QI 3D SPI, along with market leading 2D + 3D AOI solution TR7500QE. Both systems deliver industry leading performance based on CoaXPress Imaging Technology. TRI will showcase its hallmark inline PCBA inspection solution, the TR7600 SIII series CT AXI, including TR7600 SIII and TR7600F3D. Built with planar CT and high density boards in mind allows the TR7600 SIII series models to rapidly deliver very clear 3D X-ray images using high speed cameras with advanced image processing.
About TRI
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more here.
Suggested Items
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
03/26/2024 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.