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EVS International will showcase the EVS 8KLFHS in the Sono-Tek booth (#3433) at the 2018 IPC APEX EXPO, scheduled to take place February 27 - March 1, 2018 at the San Diego Convention Center in Califoria.
The EVS 8KLFHS offers a capacity of 6kg/12lbs. Its integrated hopper makes rapid transfer of dross simpler and safer, and speeds de-drossing times by up to 75%. This provides a cleaner wave with less maintenance, less downtime and a reduction in shorts and bridging, as well as the potential to discontinue the use of messy wave oils and/or dross reduction powders.
All EVS new and fully refurbished equipment offers:
- Rapid ROI (months not years)
- Improvements for your wave solder process
- ISO14001 gain or retain (RECYCLE-REDUCE-REUSE)
- Productivity improvements (Save MONEY and TIME)
- Reduction of costs (Solder-Rework-Nitrogen-Labor-Time)
- Different sized EVS machines for different applications
For more information about EVS International’s industry-leading systems, click here.
Burton Carpenter, NXP Semiconductors Inc.
It has been long established that packages using NSMD BGA pads were more resilient than ones with SMD pads to fatigue-induced solder joint cracks. However, NSMD pads in previous investigations on 292MAPBGA and 416PBGA packages failed sooner in AATS testing due to an alternate failure mode: substrate Cu trace cracks. This article looks into the effects of substrate material and package pad design on solder joint reliability of 0.8 mm pitch BGA.
Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.
Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.