EVS Improves the Wave Solder Process; To Exhibit at IPC APEX


Reading time ( words)

EVS International will showcase the EVS 8KLFHS in the Sono-Tek booth (#3433) at the 2018 IPC APEX EXPO, scheduled to take place February 27 - March 1, 2018 at the San Diego Convention Center in Califoria.

The EVS 8KLFHS offers a capacity of 6kg/12lbs. Its integrated hopper makes rapid transfer of dross simpler and safer, and speeds de-drossing times by up to 75%. This provides a cleaner wave with less maintenance, less downtime and a reduction in shorts and bridging, as well as the potential to discontinue the use of messy wave oils and/or dross reduction powders.

All EVS new and fully refurbished equipment offers:

  • Rapid ROI (months not years)
  • Improvements for your wave solder process
  • ISO14001 gain or retain (RECYCLE-REDUCE-REUSE)
  • Productivity improvements (Save MONEY and TIME)
  • Reduction of costs (Solder-Rework-Nitrogen-Labor-Time)
  • Different sized EVS machines for different applications

For more information about EVS International’s industry-leading systems, click here.

Share


Suggested Items

MacDermid Enthone to Exhibit and Present at Hong Kong Printed Circuit Association Show 2018

11/21/2018 | MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions to exhibit at HKPCA tradeshow, Shenzhen, China, December 5-7, 2018.

Survey: Low-Temperature Soldering on PCBAs

11/14/2018 | Stephen Las Marias, I-Connect007
The majority of the respondents in our survey stated that they expect low-temperature soldering to result in higher quality PCBAs.

Investigation on the Assembly Process for m03015 and a Brief Look at m0201 Components

11/14/2018 | David Geiger, Robert Pennings, and Jane Feng, Flex
Components continue to shrink in the SMT world, and the next evolution of passive components includes m03015 (009005) and m0201 (008004). The m03015 and the m0201 components will see primary adoption in products that require further miniaturization, which would be SiPs. These modules would then be assembled into products through attachment, another assembly, or via other interconnect methods. This article explores the development of an assembly process (SMT only) for the m03015 component.



Copyright © 2018 I-Connect007. All rights reserved.