Dr. Jennie Hwang to Provide Course on Preventing Production Defects and Product Failures


Reading time ( words)

Under today's manufacturing and market environment, the effort to maximize production yield, reduce cost and assure product reliability is becoming increasingly important to a company's competitiveness. Considering the new and anticipated developments in packaging and assembly and with the goal of achieving high yield and reliability in mind, the "how-to" prevent prevailing production defects and product reliability issues through an understanding of potential causes is a necessity.

On Monday, February 26, from 9:00 am to 12:00 pm, Dr. Jennie Hwang will lead the professional development course (PD18) at IPC APEX EXPO 2018, which will be held at the San Diego Conference Center, to address the top seven production defects and issues: PCB pad cratering (vs. pad lifting); BGA head-on-pillow defect; open or insufficient solder joints; copper dissolution issue; lead-free through-hole barrel filling; intermetallic compounds; and tin whisker. Specific defects associated with BTCs and PoPs and the reliability of BTC and PoP assembly will also be outlined.

The course provides a holistic overview of product reliability including the important roles of materials, processes and testing/service conditions, as well as the crucial principles behind the product reliability. The course addresses the most prevalent production issues and defects that affect yield, cost and reliability, suitable to all who are involved with or interested in SnPb and Pb-free manufacturing including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information.

The main topics to be covered in this course are as follows:

  • Premise of production defects and product failure prevention;
  • The list of common production defects and issues in lead-free assembly;
  • Product reliability – principles;
  • Product reliability – solder joint, PCB and component considerations;  
  • PCB pad cratering (vs. pad lifting) — causes and solutions;                   
  • Open or insufficient solder Joints – different sources, best practices;     
  • BGA head-on-pillow defect — causes, factors, remedies;                      
  • Copper dissolution - process factors, impact on through-hole joint reliability, mitigation;
  • Lead-free through-hole barrel filling — material, process and solder joint integrity
  • Defects of BTC and PoP solder joints - prevention and remedies;                                      
  • Intermetallic compounds – fundamentals, characteristics;                                                     
  • Intermetallic compounds – effects on failure mode, solder joint reliability;                      
  • Tin whisker - applications of concern, practical criteria, testing challenges;                         
  • Tin whisker - growth phenomena, contributing factors, risk mitigation, practical remedies;
  • Summary

To register, click here.

Share

Print


Suggested Items

High-reliability, Low-temperature Solder Alloys

05/18/2020 | Dr. Pritha Choudhury, MacDermid Alpha Electronics Solutions
Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.

This Month in SMT007 Magazine: How Engineers Can Use SPI Tools for Verification

05/06/2020 | Nolan Johnson, I-Connect007
Koh Young’s Ray Welch and Brent Fischthal detail how engineers can work with SPI tools to verify how small they can go in component size with their solder paste application, and how the company’s SPI equipment is helping not only to verify but also to help drive the development collaboration between solder paste and stencil printer manufacturers, and inspection tools and software.

This Month in SMT007 Magazine: Indium Metal Forecast—Supply Chain Strong, Demand Continues to Grow

05/05/2020 | Donna Vareha-Walsh, Indium
Indium is a critical metal for the indium-tin oxide (ITO) market and other coating applications. Donna Vareha Walsh—director of sales and global supply chain and trade compliance at Indium Corporation—describes the plentiful global supply of indium and its recycling loop, examines indium’s history of price volatility and the market reactions from the recent Fanya Metal Exchange auction, and provides an overview of indium supply and demand drivers, as well as the impact of recycling efforts.



Copyright © 2020 I-Connect007. All rights reserved.