Mycronic Inks Partnership Agreement with ELCIA ESDM Cluster and Accurex Solutions


Reading time ( words)

Mycronic AB has together with their Indian business partner Accurex Solutions Pvt Ltd. signed a partnership agreement with ELCIA ESDM Cluster in India. The ELCIA ESDM Cluster has been established under the EMC Scheme of the Department of Electronics and Information Technology (DEITY), Government of India, to support the education and industry initiative ‘Make in India’.

“Mycronic is proud to be associated with the ELCIA ESDM Cluster, first of its kind in India, where we will be providing our advanced and high-performing products for electronics production so that students, entrepreneurs, and the industry can have a first-hand experience with our cutting edge technology,” says Clemens Jargon, VP Global Dispensing, Mycronic. Mr. Rammohan, Managing Director, Accurex adds, “With the joint partnership we will support the education of a new generation of engineers, helping incubating new entrepreneurs for the electronics industry.”

“We are very proud to be part of Mycronic’s unique offer,” says Mr. Muralidhar R, Chairman of the ELCIA ESDM Cluster. “Mycronic and Accurex have a long history of cooperation with the industry in India, going back more than 30 years. It is therefore with great pleasure, we now see this cooperation continued and strengthened for the benefit of our mutual customers and the Indian industry as a whole.”

Under the joint partnership agreement Mycronic will, during a period of two years, support the ELCIA ESDM Cluster with electronics production equipment.

About Mycronic AB

Mycronic AB is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, Taiwan, United Kingdom and the United States. For more information, click here.

Share


Suggested Items

Top 10 Most-Read SMT Articles of 2017

12/29/2017 | I-Connect007
Every year, we like to take a look back at the most popular SMT news and articles. These are the top 10 most-read SMT articles from the past year.

Evaluation of Stencil Technology for Miniaturization

12/22/2017 | Neeta Agarwal, et al.*
SMT stencil printing technology continually evolves to keep pace with device miniaturization technologies. Printed circuit board assemblers have numerous new technology options to choose from, and need to determine the most effective ones to produce the highest quality and most reliable solder interconnections.

Solder Printing Process Inputs Impacting Distribution of Paste Volume

12/14/2017 | Marco Lajoie and Alain Breton, C-MAC Microelectronics
The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.



Copyright © 2018 I-Connect007. All rights reserved.