Indium Features Preforms and Reinforced Solder Ribbon at APEC 2018


Reading time ( words)

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS, at APEC 2018, to be held March 4-8 in San Antonio, Texas.

Indium is redefining solder with its InFORMS preforms and patent-pending solder ribbon for automated assembly.

According to Seth Homer, Product Manager, InFORMS are a composite fabrication consisting of solder and a reinforcing matrix that stabilizes bondline thickness. "Using an InFORM between the baseplate and substrate will ensure bondline planarity, giving your assembly a much more stable joint and increasing the reliability of your end product," he says.

InFORMS are invaluable in the production process because they provide:

  • A drop-in replacement for other bondline control methods
  • Increased lateral strength
  • Bondline co-planarity
  • Improved thermal cycling reliability

InFORMS are available in a variety of alloys, including SAC and SnPb alloys.

For more information about InFORMS, click here.

Share


Suggested Items

Why You Want Your EMS Partner to Be Annoying and Boring

01/04/2018 | Neil Sharp, JJS Manufacturing
Outsourcing part or all of your manufacturing to an electronics manufacturing service (EMS) provider can be daunting. Handing over some of the control of your business can be a scary prospect.

Equipment Matters in Solder Paste Printing

12/06/2017 | Stephen Las Marias, I-Connect007
The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.

Video from productronica 2017: Koh Young Focuses on Total Inspection Solution

11/20/2017 | I-Connect007
At the show floor of productronica 2017, I-Connect007 Technical Editor Pete Starkey speaks with Managing Director Harald Eppinger of Koh Young Europe GmbH about the principles of Koh Young’s total 3D inspection solution for SMT process optimization and yield improvement.



Copyright © 2018 I-Connect007. All rights reserved.