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Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS, at APEC 2018, to be held March 4-8 in San Antonio, Texas.
Indium is redefining solder with its InFORMS preforms and patent-pending solder ribbon for automated assembly.
According to Seth Homer, Product Manager, InFORMS are a composite fabrication consisting of solder and a reinforcing matrix that stabilizes bondline thickness. "Using an InFORM between the baseplate and substrate will ensure bondline planarity, giving your assembly a much more stable joint and increasing the reliability of your end product," he says.
InFORMS are invaluable in the production process because they provide:
- A drop-in replacement for other bondline control methods
- Increased lateral strength
- Bondline co-planarity
- Improved thermal cycling reliability
InFORMS are available in a variety of alloys, including SAC and SnPb alloys.
For more information about InFORMS, click here.
Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.
Mark Whitmore and Jeff Schake, ASM Assembly Systems
A new generation of near microscopic size SMT chip capacitors has appeared in the market, known as either 0201 or 008004. This article investigates and characterizes the stencil printing process for compatibility with M0201 capacitor assembly. Effects of circuit board quality, stencil thickness, and stencil nano-coating are evaluated against solder paste volume transfer efficiency and raw-volume print distribution.
Russell Poppe, JJS Manufacturing
AOI has an invaluable role to play in speeding up the process of PCB production, in ensuring extreme precision to catch even the smallest of defects, and in minimizing the potential for time-consuming and costly reworking.