Indium Features Preforms and Reinforced Solder Ribbon at APEC 2018


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Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS, at APEC 2018, to be held March 4-8 in San Antonio, Texas.

Indium is redefining solder with its InFORMS preforms and patent-pending solder ribbon for automated assembly.

According to Seth Homer, Product Manager, InFORMS are a composite fabrication consisting of solder and a reinforcing matrix that stabilizes bondline thickness. "Using an InFORM between the baseplate and substrate will ensure bondline planarity, giving your assembly a much more stable joint and increasing the reliability of your end product," he says.

InFORMS are invaluable in the production process because they provide:

  • A drop-in replacement for other bondline control methods
  • Increased lateral strength
  • Bondline co-planarity
  • Improved thermal cycling reliability

InFORMS are available in a variety of alloys, including SAC and SnPb alloys.

For more information about InFORMS, click here.

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