IWLPC Technical Committee Announces Best Presentation & Papers Awards for 2017


Reading time ( words)

The IWLPC Technical Committee is pleased to announce the Best of Conference, Best Presentation & Best Papers in WLP, 3D, Advanced Manufacturing and Test tracks as chosen by the technical committee and attendees based on technical merit, relevance, originality, knowledge of subject, quality of material, and quality of presentation.

Best of Conference Presentation - Guilian Gao, Ph.D., XPERI/Invensas

"Development of Hybrid Bond Interconnect Technology for Die-To-Wafer and Die-to-Die Applications"

Best of Conference Paper - Wolfram Steller, Ph.D., Fraunhofer IZM AAID

"Dual Side Chip Cooling Realized by Microfluidic Interposer Processing on 300mm Wafer Diameter"

Best of 3D Track Paper - Wolfram Steller, Ph.D., Fraunhofer IZM AAID

"Dual Side Chip Cooling Realized by Microfluidic Interposer Processing on 300mm Wafer Diameter"

Best of WLP Track Paper - Tanja Braun, Ph.D., Fraunhofer IZM

"Fan-Out Wafer and Panel Level Technology for Advanced LED Packaging"

Best of Advanced Manufacturing and Test Track Paper - Paul Werbaneth, Intevac, Inc.

"Process and Productivity Results from a Carrier-Based Linear Transport PVD Systems for RDL Seed Layer Deposition in Fan-Out Packaging Applications"

About IWLPC

IWLPC brings together the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV and integrated system packaging.

Share

Print


Suggested Items

IPC APEX EXPO Reflections

02/10/2020 | Nolan Johnson, I-Connect007
The sun may have risen and set on the 2020 edition of IPC APEX EXPO, but the developments from the week in San Diego certainly will linger with us for some time. Editor Nolan Johnson provides a summary of the events at IPC APEX EXPO 2020 in San Diego, California.

SMTAI 2019: Technical Sessions Overview and 2020 Preview

10/01/2019 | Real Time with...SMTAI
Karlie Severinson, SMTA events and administrative manager, gives Nolan Johnson an overview of the SMTAI 2019 technical sessions and plans for next year's event.

Reliability vs. Failure

07/01/2019 | Nolan Johnson, I-Connect007
Summer is officially underway here in the Northern Hemisphere, and just like the temperatures, we’re turning up the heat in this issue and getting technical. Enter “Reliability Man,” the hero who must persevere against all the challenges thrown in his path.



Copyright © 2020 I-Connect007. All rights reserved.