Indium’s Sandy-Smith to Lead Panel at IPC APEX EXPO 2018


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Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will lead a special panel discussion of industry experts at the IPC APEX EXPO technical conference on Thursday, March 1 in San Diego, California.

The Buzz Session, led by Sandy-Smith, will start at 10:30 am on March 1 and cover Test Methods for Assessing Ionic Cleanliness. The electronics industry continues to search for updated test methods designed to accurately assess ionic cleanliness. While the incumbent Resistivity of Solvent Extract (ROSE) method is no longer considered the best method, emerging methods have yet to reach the level of industry standardization. Process, materials, and assembly experts will discuss the important factors to be considered when choosing the best method to test ionic cleanliness.

Panel participants include:

  • David Lober, Process Chemist, Kyzen Corporation
  • Douglas Pauls, Principle Materials Process Engineer, Rockwell Collins
  • Jason Fullerton, Alpha Assembly Solutions
  • Terry Munson, Foresite, Inc.
  • Graham Naisbitt, Gen3 Systems

For more information about this session, click here.

Brook Sandy-Smith is a leader in the industry for technical knowledge and support. As a Technical Support Engineer based at Indium Corporation’s headquarters in Clinton, NY, she specializes in PCB Assembly Materials and works closely with customers to develop custom solutions and optimize their processes. Sandy-Smith has a passion for developing and implementing standardization for test methods, and is an SMTA Certified Process Engineer. She is active in several IPC committees, SMTA programs, and iNEMI projects, and currently serves as chair of the J-004 committee and as Vice President of technical programs for the SMTA Empire chapter. Brook graduated from the International Engineering Program at the University of Rhode Island with a degree in Chemical Engineering and German language.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

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