Indium Features Metal Thermal Interface Materials for Burn-In and Test at BiTS Workshop 2018


Reading time ( words)

Indium Corporation will feature its metal thermal interface materials for burn-in, including Heat-Spring and HSMF-OS, at Burn-in & Test Strategies Workshop on March 4-7 in Mesa, Arizona.

Indium Corporation’s Heat-Spring is designed for use in the burn-in process. It is patterned to optimize contact with non-planar surfaces with a pressure range of only 35-100+ psi. Heat-Spring is available in InAg and InSn alloys and pure indium.

HSMF-OS has a multi-layer construction with a total thickness of 0.004” that is designed for multiple insertions. It has an aluminum layer that acts as an interface with the device under test, and has a tensile strength of approximately 90 MPa with a soft, compliant polymer backing, which provides a configuration with “designed-in” insertion survivability.

To learn more about Indium Corporation’s metal thermal interface materials for burn-in and test, click here.

Share

Print


Suggested Items

Mentor and Seica Partner for Data Prep and Testing Big Boards

01/18/2019 | Pete Starkey, I-Connect007
Mark Laing, business development manager of the Valor division at Mentor, a Siemens company, and Luca Corli, director of sales at Seica, speaks with I-Connect007 Technical Editor Pete Starkey about the partnership between their two companies, which enables efficient data preparation for testing big boards, and accelerates new product introduction (NPI) cycles.

Solder Paste Selection/Qualification

01/16/2019 | Stephen Las Marias, I-Connect007
In a recent SMT007 survey, we asked the following question: " What are your challenges when it comes to solder paste selection/qualification?" Here are just a few of the replies, slightly edited for clarity.

AOI Programs with a Magic Click

12/12/2018 | Jens Kokott and Matthias Muller, Goepel electronic
Production runs of 10–1,000 assemblies are everyday life for an EMS provider. But what if important staff are on vacation, and component deliveries are very much delayed? And then the customer is determined to have AOI, but the layout of the assembly is highly customized, making it virtually impossible to use complete library entries. Here's how AOI programs can help you in these scenarios.



Copyright © 2019 I-Connect007. All rights reserved.