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Indium Corporation will feature its metal thermal interface materials for burn-in, including Heat-Spring and HSMF-OS, at Burn-in & Test Strategies Workshop on March 4-7 in Mesa, Arizona.
Indium Corporation’s Heat-Spring is designed for use in the burn-in process. It is patterned to optimize contact with non-planar surfaces with a pressure range of only 35-100+ psi. Heat-Spring is available in InAg and InSn alloys and pure indium.
HSMF-OS has a multi-layer construction with a total thickness of 0.004” that is designed for multiple insertions. It has an aluminum layer that acts as an interface with the device under test, and has a tensile strength of approximately 90 MPa with a soft, compliant polymer backing, which provides a configuration with “designed-in” insertion survivability.
To learn more about Indium Corporation’s metal thermal interface materials for burn-in and test, click here.
Jason Fullerton, Alpha Assembly Solutions
This paper investigates and compares the performance of no-clean liquid wave soldering fluxes using a commercially available localized extraction and cleanliness testing system, and surface insulation resistance (SIR) testing. Find out which test is suitable for your processes.
Joe Russeau, Precision Analytical Laboratory, and Mark Northrup, IEC Electronics
Industry experts are saying that Resistivity of Solvent Extract (ROSE) testing should be retired as a cleanliness or process control test in the PCB assembly industry. This article emphasizes that position by highlighting some work by the authors comparing component cleanliness results from the ROSE against Ion Chromatography (IC) results.
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