Reading time ( words)

ZESTRON will feature a live demo of the VIGON RC 303 reflow oven cleaning agent, with a newly developed pressure sprayer at IPC APEX 2018.

VIGON RC 303 is a water-based cleaning agent specifically developed to remove all types of baked-on flux residues from reflow ovens and wave solder systems. The Pressure Sprayer can effectively apply cleaning agent onto large surfaces within seconds. The refillable Pressure Sprayer is the ideal solution for cleaning reflow ovens and wave solder systems as well as for the manual cleaning of oven parts, such as condensations traps or solder frames.

Visit the ZESTRON booth #2523, at IPC APEX 2018 for live demonstrations. Our team is available to discuss the complete family of defluxing agents including our latest products for semiconductor cleaning applications.


Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics and semiconductor manufacturing industries. With seven worldwide technical centers and the largest team of engineers focused on high precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.

For additional information and to tour one of our unparalleled technical centers, please click here.


Suggested Items

Cleaning with Data

03/19/2018 | Barry Matties, I-Connect007
Tom Forsythe, vice president of KYZEN, spoke to Barry Matties about KYZEN’s new process control monitoring and data service. They discussed the drivers behind these developments, the company's focus on managing data, and how KYZEN plans to support an industry embracing more cleaning and Industry 4.0.

Manufacturability: Pad Relief and Mask Relationship to Solder Joint Volume

03/09/2018 | Ken Horky, Peterson Manufacturing
Electronic assembly thermal management has always been an issue but has become more significant as we pack more power and function into a smaller form factor. In recent years, the growing use of LEDs for illumination on a large scale has presented additional thermal demands.

RTW IPC APEX EXPO: Indium Discusses Fighting Solder Voids

03/06/2018 | Real Time with...IPC
Voiding has increasingly become one of the most critical challenges in the soldering process. In this interview, Christopher Nash, product manager for the PCB assembly solder paste business of Indium, speaks about how the company is helping customers address the voiding challenge.

Copyright © 2018 I-Connect007. All rights reserved.