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Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will present its void reducing preform solutions at the EPP Innovations Forum on Wednesday March 7, in Böblingen, Germany.
Alpha’s presentation will be given by Ralph Christ, Customer Technical Support Manager – DACH Region, and will focus on the ways that electronics assembly processes can be optimized by using ALPHA TrueHeight Spacer Blocks to prevent BGA solder bridging and ALPHA® TrueHeight® Preforms to prevent die tilt on semiconductor applications and ensure consistent bondline thickness.
“Alpha’s TrueHeight Spacer Blocks are an effective way to prevent solder bridging on BGA components after reflow”, explains Ralph Christ. “The burr-free, non-collapse discs are coated with a barrier layer of nickel and finish coated with gold. They are designed to be automatically placed and reflowed onto the PCB pad, enabling a defined minimum height to be achieved at the corners of the BGA. This prevents the excess collapse of the solder spheres that causes adjacent solder bridging.”
For the optimization of semiconductor applications ALPHA TrueHeight Preforms have been designed to deliver consistent bondline thickness and minimized die tilt. This results in predictable reliability and performance. Process Optimization is the focus of this year’s EPP Innovations Forum, with the main aim of the event to transfer knowledge and to continue to maintain and expand the competitiveness of electronics in Germany. The event will bring together a number of key industry professionals who will each give a 20-minute presentation on the topic. There will also be breaks throughout the day for networking opportunities.
To register for the event please click here.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.
For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.