Metcal’s Robotic Soldering Wins IPC APEX EXPO Innovation Award


Reading time ( words)

Metcal has been awarded a 2018 IPC APEX EXPO Innovation Award for its Connection Validation (CV) Robotic Soldering System. The award was presented to the company during a Wednesday, February 28, 2018 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO. Robotic soldering is becoming more commonplace as manufacturers look to reduce risk and increase productivity.

Metcal’s new CV Robotic Soldering System addresses these needs by combining its patented CV technology with a new Smart Interface System. CV reduces unnecessary dwell time by signalling to the system to move to the next solder joint in the program after a good joint is formed. The Smart Interface System simplifies the programming process by integrating system controls through an easy to use interface.

“We are honored to win the IPC Innovation Award for our Connection Validation Robotic Soldering System,” said Christopher Larocca, President of OK International, which owns Metcal. “Our customers are rapidly adopting robotic soldering equipment as manufacturers look to mitigate risk, increase efficiency and establish production traceability. Our CV Robotic Soldering System addresses these needs by combining its patented CV technology and a new Smart Interface System.”

The IPC APEX EXPO Innovation Awards were established to honor outstanding products and services for the electronics industry. Products and services are reviewed, rated and scored by a panel of industry experts.

About Metcal

Metcal is a benchtop solutions expert that has delivered broad value to customers since its Silicon Valley beginnings in 1982. Offering unrivalled performance, risk mitigation, and ROI, we give electronics manufacturers in automotive, aerospace, medical devices and military sectors the tools—and the confidence—they need to develop faster, safer, more advanced products. Metcal provides advanced technology products across hand soldering, convection rework, fume extraction, and fluid dispensing applications. For more information, click here.

Share


Suggested Items

Strategies for Choosing Solder Paste for Successful Electronics Assembly

08/10/2018 | Jason Fullerton, Alpha Assembly Solutions
One common question from solder customers is, "How do I test and evaluate new solder pastes?" Although that seems like it should be a straightforward question with an easy answer, this could not be further from the truth. This article tells more about this, and how to best select solder pastes for your product.

Evaluating the Impact of Powder Size and Stencils on Solder Paste Transfer Efficiency

07/31/2018 | T. O’Neill, C. Tafoya, and G. Ramirez, AIM Metals and Alloys
Building upon an earlier study that focused on solder paste powder size, room-temperature aging and PCB pad and aperture designs, this study continues to investigate powder mesh size, but also examines stencil surface treatments and stencil foil tension.

Flex Circuit Assembly: Challenges and Strategies for Success

07/27/2018 | Stephen Las Marias, I-Connect007
The flexible printed circuit market is on track for growth. But dealing with flex circuits during assembly is very different from rigid PCBs. This article highlights some of the assembly challenges when working with flex circuits, and strategies to address them.



Copyright © 2018 I-Connect007. All rights reserved.