Cirtronics Acquires 4th Pillarhouse Selective Soldering System


Reading time ( words)

Pillarhouse USA Inc. has announced that Cirtronics Corp. has placed an order for a 4th Pillarhouse selective soldering system, for their manufacturing facility.

David Patterson, Chief Operating Officer at Cirtronics, commented, "Cirtronics is committed to producing high-quality, complex products, so it is vital that we make smart investments that support our customers' success. Our Engineering and Quality teams are constantly evaluating the level of investment required when manufacturing each and every product. Adding our 4th Pillarhouse Selective Solder machine increases our throughput with excellent process controls and reduces risk. We selected another Pillarhouse system due to our excellent experience with the others we have in our line."

Jonathan Wol, President of Pillarhouse USA Inc., commented, "Pillarhouse is proud to have strong working relationships with companies like Cirtronics, who is an excellent example of a company that leverages the best available manufacturing technology and know-how to produce high quality, yet very complex products. Pillarhouse is pleased to continue our long term working relationship and looks forward to many more years of partnership."

Share


Suggested Items

Strategies for Choosing Solder Paste for Successful Electronics Assembly

08/10/2018 | Jason Fullerton, Alpha Assembly Solutions
One common question from solder customers is, "How do I test and evaluate new solder pastes?" Although that seems like it should be a straightforward question with an easy answer, this could not be further from the truth. This article tells more about this, and how to best select solder pastes for your product.

Evaluating the Impact of Powder Size and Stencils on Solder Paste Transfer Efficiency

07/31/2018 | T. O’Neill, C. Tafoya, and G. Ramirez, AIM Metals and Alloys
Building upon an earlier study that focused on solder paste powder size, room-temperature aging and PCB pad and aperture designs, this study continues to investigate powder mesh size, but also examines stencil surface treatments and stencil foil tension.

Flex Circuit Assembly: Challenges and Strategies for Success

07/27/2018 | Stephen Las Marias, I-Connect007
The flexible printed circuit market is on track for growth. But dealing with flex circuits during assembly is very different from rigid PCBs. This article highlights some of the assembly challenges when working with flex circuits, and strategies to address them.



Copyright © 2018 I-Connect007. All rights reserved.