IPC APEX EXPO Proves a Tremendous Success for Koh Young


Reading time ( words)

On the heels of installing its 11,000th inspection solution at Dynamic Manufacturing, a Matric Group Company, Koh Young experienced its best IPC APEX EXPO. “With more qualified leads than ever before, the Americas market is embracing the leading technologies and solutions we provide to the industry,” said Juan Arango, Managing Director at Koh Young America.

KY.jpg

Koh Young demonstrated its 8030-3, the industry’s best-selling SPI (solder paste inspection) system, plus it introduced new features to enhance yields. An example is the 8030-3 with auto repair, which integrates a dispenser to automatically add a measured amount of solder to repair insufficient deposits before the board leaves the machine. Another example was our KSMART Process Optimizer (KPO) that connects the printer to the SPI and enables a closed-loop, print monitoring system powered by the Koh Young AI Platform.

Beyond our new Zenith 2 AOI solution, the show was an ideal opportunity to introduce several platforms for new markets. “I was pleased to see such great excitement about our new KY-P3 pin inspection machine and the Infy, which is designed for machined parts inspection”, said Joel Scutchfield, Americas Sales Manager at Koh Young America. “These products open entirely new markets for us. We are eager to bring these solutions to our customers and help them solve long-standing production quality issues,” concluded Mr. Scutchfield.

Koh Young has been driving toward the smart factory for years and we showed our resolve in several ways at APEX. “Not only did Koh Young proudly participate in the IPC Connected Factory Exchange (CFX) initiative, which allowed attendees to view machine data in real-time on their mobile device, we highlighted numerous ways we can convert the significant amounts of data collected with true 3D measurement into actionable information,” said Brent Fischthal, Sr. Marketing Manager at Koh Young America. “Using the latest artificial intelligence technology, KSMART helps enable the Smart Factory with statistical process control from SPC@KSMART to instant program refinements with OPO@KSMART (Offline Programming Optimizer).” Throughout the show, Koh Young presented how its new AI Platform intelligently applies real-time data to improve the production process.

As IPC APEX Expo concludes, we turn to Semicon China. At the show, Koh Young will highlight its latest innovations for the semiconductor market, including new hardware and software solutions, which drive production and process improvements. We welcome show attendees to visit us in booth 5381 of hall N5 at the Shanghai New International Expo Center during 14-16 March 2018. If you cannot attend the show, you can learn more about Koh Young Technology and its best-in-class inspection solutions click here.

About Koh Young Technology Inc.

Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, China, and the United States. These local facilities ensure it maintains close communications with its growing customers base, while providing them with access to a global network of process experts.

Share


Suggested Items

Under the Hood: Solder Joint Reliability

05/21/2018 | Burton Carpenter, NXP Semiconductors Inc.
It has been long established that packages using NSMD BGA pads were more resilient than ones with SMD pads to fatigue-induced solder joint cracks. However, NSMD pads in previous investigations on 292MAPBGA and 416PBGA packages failed sooner in AATS testing due to an alternate failure mode: substrate Cu trace cracks. This article looks into the effects of substrate material and package pad design on solder joint reliability of 0.8 mm pitch BGA.

Solving Reliability and Thermal Management Challenges in Automotive Electronics

05/01/2018 | Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.



Copyright © 2018 I-Connect007. All rights reserved.