TRI to Participate on Fuji's ELF Standard for M2M in SMT Assembly


Reading time ( words)

Test and inspection systems provider Test Research Inc. (TRI) is participating in Fuji’s ELF Standard for M2M in SMT Assembly. TRI believes that Industry 4.0 will revolutionize how the SMT Industry operates by being able to interconnect different machines from different vendors providing and optimizing their production lines.

The ELF standard is reshaping the SMT assembly industry by providing a lean production and manufacturing with faster turnarounds in production levels, thus increasing its participant’s competitiveness. The ELF standard aims to minimize resistance to facilitate it. By the cooperating with SMT assembly innovators, Industry 4.0 trend will significantly benefit from standards that the participating vendors can follow.

Sharing the same values and goals of Fuji’s standard, TRI will join other industry pioneers such as Panasonic, Yamaha and CKD Corporation. TRI follows the same principles of manufacturability consideration design (DFM) and environmentally-friendly design (DFE) by providing high-quality assurance inspection to the SMT assembly industry.

About TRI

TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at www.tri.com.tw.

Share


Suggested Items

Under the Hood: Solder Joint Reliability

05/21/2018 | Burton Carpenter, NXP Semiconductors Inc.
It has been long established that packages using NSMD BGA pads were more resilient than ones with SMD pads to fatigue-induced solder joint cracks. However, NSMD pads in previous investigations on 292MAPBGA and 416PBGA packages failed sooner in AATS testing due to an alternate failure mode: substrate Cu trace cracks. This article looks into the effects of substrate material and package pad design on solder joint reliability of 0.8 mm pitch BGA.

Solving Reliability and Thermal Management Challenges in Automotive Electronics

05/01/2018 | Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.



Copyright © 2018 I-Connect007. All rights reserved.