Koh Young Technology Showcasing Quality Assurance Solutions at SEMICON China


Reading time ( words)

Koh Young Technology, the leading 3D measurement and inspection company, will highlight its innovative Meister SPi (Solder Paste Inspection) at SEMICON China from March 14-16 in booth 5381, hall N5 of the Shanghai New International Expo Center.

The Koh Young’s Meister combines industry leading measurement accuracy and inspection reliability to master 3D inspection of advanced IC packaging. The Meister SPi is our flagship in-line 3D solder paste inspection, which combines Koh Young’s innovative vision algorithms with advanced resolution optics. Though recently introduced, major semiconductor assembly providers throughout Asia have already qualified the Meister SPi for mass production. The system supports thin solder inspection capabilities down to 10um to handle numerous package types like SiP, Fan-out packaging, flip chip, WLCSP, and more.

Koh Young will also demonstrate its Zenith 3D AOI with enhanced functionality. The world’s best-selling first full 3D AOI system, Zenith now uses AI-driven Auto Programming to reduce job preparation by up to 70%. The software automatically develops component registration and inspection condition setting, which ensures faster programming based on 3D measurement and intelligent analysis.

During this period of time, Koh Young Technology will also attend productronica China 2018 in the Shanghai New International Expo Center. “Smart Production” is the motto of productronica China 2018. Koh Young together with other leading players in the SMT industry will install assembly lines in booth 2120, Hall E2 - the SMT Innovation Point and Demo Line. As the leading 3D inspection provider, Koh Young will exhibit their high-efficiency, high-performance Zenith 3D AOI and KY8030-3 3D SPI.

“With over 11,000 inspection systems installed worldwide, Koh Young continues to deliver innovative inspection solutions to ensure our customers achieve world-class production quality,” commented Jay Park, head of the Product Planning Team at Koh Young Technology, “We are more than excited to share our cutting-edge technologies with our customers at the show.

About Koh Young Technology, Inc.

Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, China, and the United States. These local facilities ensure it maintains close communications with its growing customers base, while providing them with access to a global network of process experts.

Share


Suggested Items

What's the Scoop? APEX CFX Showcase

05/03/2018 | Philip Stoten, Scoop
The IPC Connected Factory Exchange (CFX) demo at the recent IPC APEX EXPO 2018 trade show in San Diego, California, is a great example of industry collaboration. The CFX Showcase at APEX had 245,000 CFX website page views; 701,200 CFX messages transmitted; and 664.5 million bytes of data exchanged; and the whole thing was pulled together in a matter of weeks. Here's what the participants in the program have got to say.

RTW IPC APEX EXPO: COMET Technologies Highlights Product Range and New Facility

03/12/2018 | Real Time with...IPC
Craig Arcuri of COMET Technologies details the numerous ways his company's technology is employed to manufacture and inspect a wide range of products, from chips to jet engine turbine blades. He also speaks about Lab One, the company's new technology and application center in Silicon Valley.

Mycronic Announces the Acquisition of Vi TECHNOLOGY

02/21/2018 | Barry Matties, I-Connect007
Mycronic recently announced the acquisition of Vi TECHNOLOGY, with the intent of combining VIT’s inspection technology with Mycronic’s jetting capabilities. In an interview with I-Connect007, Olivier Pirou, Managing Director of VIT, discusses more about the merger and how this will help VIT contend in such a competitive environment.



Copyright © 2018 I-Connect007. All rights reserved.