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There is a direct relationship between cleanliness and reliability. Most contamination-related product failures could have been predicted by cleanliness testing and thereby avoided. With industry standards changing, various cleanliness testing methods are being considered.
In line with this, Aqueous Technologies will be holding a webinar titled “Cleanliness Quantification Techniques... How Clean is Clean Enough?” on March 20, 2018 at 8am PST.
This 75-minute free webinar will present information on several post-reflow circuit assembly cleanliness quantification methods, including bulk extraction ROSE testing, localized extraction ROSE testing, ion chromatography, surface insulation resistance (SIR), presence of flux (chemical reaction), testing visual testing, and other cleanliness testing methods.
This will be presented by three industry experts: Mike Konrad, president/CTO of Aqueous Technologies; Terry Munson, president, Foresite Inc.; and Kalyan Nukala, application engineer, Zestron.
For more information or to register, click here.
Patty Goldman, I-Connect007
At the recent SMTA International conference, I-Connect007 Managing Editor Patty Goldman caught up with Ram Wissel, VP of Global Technology at KYZEN, to talk about the latest cleaning challenges, and bringing Industry 4.0 into the world of cleaning in PCB assembly.
Karen Tellefsen, Alpha Assembly Solutions
Circuit boards are not always perfect after reflow or wave soldering. Scrapping boards with one or two defects is expensive, so rework happens. A good concept for rework is less is more, especially less flux. Use as little rework flux as possible, as in the old Brylcreem ads, "Just a little dab'll do ya."
Venesia Hurtubise, Elizabeth Norwood, Wells Cunningham, and Laura LaPlante, MicroCare Corp.
In line with increasing regulations on electronics manufacturing, many changes have been made to the electronics world, and thus the circuit board manufacturing process. Lead-free, no-clean and halide-free flux formulations have introduced new cleaning obstacles, especially on ever-shrinking component sizes. To maintain high cleanliness standards for modern circuitry, new sophisticated cleaning chemistries are required.