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Craig Arcuri of COMET Technologies discusses with I-Connect007 Guest Editor Joe Fjelstad the numerous ways his company's technology is employed to manufacture and inspect a wide range of products, from chips to jet engine turbine blades.
Arcuri also speaks about Lab One, the company's new technology and application center in Silicon Valley.
To watch the interview, click here.
Barry Matties, I-Connect007
The recent SMT Hybrid Packaging show in Nuremberg, Germany, marked the second opportunity for IPC to showcase its new Connected Factory Exchange (CFX) initiative. In this interview, David Bergman, VP for international relations at IPC, tells us more on the overall reception of CFX and the benefits users are seeing thus far. He also provides an update on what’s next for the open source standard.
Real Time with...IPC
Jim Wertin, technical sales manager at Heraeus Electronics, shares news about the company's latest product offerings, as well as its newly established application laboratory, which helps customers and potential customers resolve production issues and improve the quality of their products.
Stephen Las Marias, I-Connect007
For the past two to three years, almost every exhibitor in almost every trade show focused on the electronics manufacturing industry has an "Industry 4.0 Compatible" sign in their booth. As of today, the best question to ask is, "Compatible with what?" There has really been no standard yet developed toward this goal, and Industry 4.0 has been just a buzz word.