Kulicke & Soffa Further Extends China Presence


Reading time ( words)

Kulicke & Soffa Industries Inc. has officially opened its China Demo Center in its Suzhou manufacturing facility. K&S Suzhou was established in 2002, spanning over 17,000 square meters, encompasses the company’s equipment software and process engineering, R&D as well as production lines for consumables products such as capillaries, blades and wedge bonding tools.

The 1,200 square meters Demo Center houses a broad assembly line of the latest K&S solutions, including RAPID Pro GEN-S (Smart) Series ball bonder, OptoLux ball bonder for LED and APAMA DA (Die Attach) equipment. Customers can now visit the site for demonstration of the end-to-end surface mount technology (SMT) solution and to develop rapid prototyping setup from screen printing, soldering paste inspection, pick-and-place to automated optical inspection (AOI) systems. Besides the SMT solution, a full assembly line of K&S CMOS Image Sensor (CIS) solution is anticipated to complete in the next few weeks. The new China Demo Center also includes equipment repair and refurbishment facilities.

"The opening of Kulicke and Soffa’s China Demo Center marks another significant milestone for the Company. It further strengthen our strong collaboration with customers and industry partners to develop and drive next-generation packaging solutions in response to the industry's emerging opportunities," said Fusen Chen, Kulicke and Soffa’s President and Chief Executive Officer.

About Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices.

Share

Print


Suggested Items

Who’s the Best of the Best in Hand Soldering?

01/11/2019 | Nolan Johnson, I-Connect007
IPC APEX EXPO 2019 will include the new IPC World Championship Hand Soldering and Rework Competition on the expo floor on January 29 and 30. Twelve competitors from Britain, China, France, Germany, India, Indonesia, Japan, South Korea, and Thailand will compete for the crown and the title of the first-ever IPC World Hand Soldering and Rework Champion.

Top 10 Most-Read SMT007 Columns of 2018

12/31/2018 | Stephen Las Marias, I-Connect007
Each year, we compile the lists of most-read news, articles and columns. Here are the top 10 most-read SMT007 columns from the past year.

Challenges in Flex Circuit Assembly

12/19/2018 | I-Connect007 Research Team
In a recent I-Connect007 survey on flex circuits, we asked the following question: What are some of the challenges that you face utilizing flex circuits? Here are just a few of the replies, edited slightly for clarity.



Copyright © 2019 I-Connect007. All rights reserved.