-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
NEO Tech Releases New LTCC and AlN Design Guidelines
March 14, 2018 | NEO TechEstimated reading time: 1 minute
NEO Tech announces that it recently produced and published new and expanded guidelines for the manufacture of Low-Temperature Co-fired Ceramic (LTCC) and Aluminum Nitride (AlN) packaging solutions.
NEO Tech has emerged as North America’s leading manufacturer of high-reliability LTCC and high-temperature co-fired (HTCC) substrates and packages. These fabrication technologies provide unique solutions for high interconnect density, compact packages and high-frequency applications.
Key advantages include:
- Embedded passive components
- High density interconnect
- Cost-competitive plated Silver systems
- TCE closely matches that of Si, GaAs and SiC (and other associated compounds)
- Brazed on components (connectors, seal ring, heat spreaders)
- Hermetic packaging
- Outstanding long-term reliability
The guidelines include comprehensive information that highlight capabilities, overview and standard design considerations, which include conductors, vias, cavities, special high-frequency design provisions, capacitors, inductors, post-fired conductors, soldering, material thermal properties, and electrical and mechanical properties of LTCC.
NEO Tech’s experience in ceramics processing has resulted in the development of the world’s most reliable multilayer ceramics technology available to the microelectronics industry.
About NEO Tech
NEO Tech combines the strengths of three leading contract manufacturers: NATEL, EPIC, and OnCore. With over 40 years of heritage in electronics manufacturing, NEO Tech focuses on low-medium-volume/high-mix, high-complexity products primarily in the medical, aerospace & defense and industrial markets.
NEO Tech offers full product lifecycle engineering services, manufacturing and testing of microelectronics, cable & harness interconnect products, PCBA, full box build services and aftermarket repair and fulfillment services. The companies that form NEO Tech have been known for solving tough engineering problems that result in high-reliability, high-quality electronic solutions for customers.
Headquartered in Chatsworth, CA, NEO Tech has manufacturing and engineering locations in California, Colorado, Illinois, Massachusetts, Nevada, Ohio, Mexico, and China. NEO Tech holds and maintains industry specific certifications that include ISO9001, AS9100, ISO13485, ISO14001 and MIL-PRF-38534. To learn more, click here.
Suggested Items
GlobalFoundries Commits to Achieving Net Zero Emissions and Carbon-Neutral Power by 2050
04/23/2024 | GlobalFoundriesGlobalFoundries (GF) is furthering its commitment to sustainable operations and fighting climate change with the announcement of two new long-term goals to achieve net-zero greenhouse gas (GHG) emissions and 100% carbon-neutral power by 2050.
ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement
04/23/2024 | ROHMROHM and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced today the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company.
IDTechEx Report Unveils 3D Electronics Status and Opportunities
04/22/2024 | PRNewswire3D electronics is an emerging manufacturing approach that enables electronics to be integrated within or onto the surface of objects. 3D electronic manufacturing techniques empower new features, including mass customizability, greater integration, and improved sustainability in the electronics industry.
Altus Group Helps BitBox Unlock Productivity and Efficiency Gains with New Reflow Oven
04/22/2024 | Altus GroupAltus Group, a leading provider of capital equipment, has recently assisted BitBox, a UK-based electronics design, engineering and manufacturing company in upgrading its operations with the implementation of a new reflow oven from Heller Industries.
Growth Potential: Electronics Manufacturing Driving Massive Surge in Manufacturing Investment
04/22/2024 | Shawn DuBravac, IPCIn the early months of the pandemic, investment in manufacturing infrastructure, such as plants and production facilities, declined sharply. Real investment dropped over 11%, before finally recovering to pre-pandemic levels in the first half of 2022. Over the past two years, however, several factors have combined to drive manufacturing investment to record levels.