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Test Research, Inc. (TRI) will exhibit a comprehensive Smart Factory inspection solution, combining 3D SPI, 3D AOI, 3D AXI and multi-core ICT at NEPCON China 2018 exhibition. Visit us at booth 1E40 in Hall 1 of Shanghai World Expo & Convention Center from April 24-26, 2018 and discover the leading one stop solution for PCBA inspection.
The 2018 TRI lineup for NEPCON China will include award winning TR7700Q 3D AOI inspection with leading-edge solder fillet inspection and TR7500QE high performance 3D AOI, designed for zero-escape industry applications. Also featured this year are TR7007Q stop-and-go 3D SPI, revolutionary SPI solution TR7007 SII Plus and all new TR5001Q SII INLINE Multi-core ICT. TRI’s lineup will also include first-class high resolution 3D CT AXI TR7600 SIII and TR7600F3D.
Discover how TRI's PCBA test and inspection solutions work together with Industry 4.0 data based YMS 4.0 management infrastructure to bring you maximum value in the production line and minimize quality costs. Visit us at NEPCON China booth 1E40 for a personal tour of TRI’s acclaimed solution lineup.
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more here.