IPC Volunteers Honored for their Contributions to Industry at IPC APEX EXPO 2018


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For their leadership of the 5-31j committee in revising IPC-7526A, Mike Bixenman, Kyzen; and Greg Wade, Indium, earned a committee leadership award. For their contributions to IPC-7526A, Dave Adams, Rockwell Collins; Caroline Ehlinger, Rockwell Collins; Jason Keeping, Celestica; Ravi Parthasarathy, Zestron; Doug Pauls, Rockwell Collins; Mark Reimer, Rockwell Collins; Jeff Schake, ASM Assembly Systems; Chrys Shea, Shea Engineering Services; Umut Tosun, Zestron; and Lee Wilmot, TTM Technologies, Inc., earned a distinguished committee service award.

For their leadership of the 5-33aUT subcommittee in the development of White Paper 021, Considerations of New Classes of Coatings for IPC-CC-830C, Doug Pauls, Rockwell Collins; and Amanda Rickman, Raytheon, earned a committee leadership award.

For his leadership of the 7-31H committee in the development of IPC-HDBK 620, a guidance document for those using IPC-WHMA-A-620 and IPC-D-620, Robert Cooke, NASA Johnson Space Center, earned a committee leadership award. For their significant contributions to the completion of IPC-HDBK 620, Gerald Leslie Bogert, Bechtel Plant Machinery Inc.; Bud Bowen, Winchester Electronics Division; Larry Joy, Amptech, Inc; Sean Keating, Amphenol Limited (UK); Theodore Laser, L-3 Communications; John Tinker, Teledyne Reynolds, earned a special recognition award. For their contributions, James Blanche, NASA Marshall Space Flight Center; Constantino Gonzalez, ACME Training & Consulting; Russell Kido, Practical Components Inc.; Garry McGuire, NASA Marshall Space Flight Center; Randy McNutt, Northrop Grumman Aerospace Systems; Bob Potysman, AssembleTronics, LLC.; Erik Quam, Schlumberger Well Services; Richard Rumas, Honeywell Canada; Sharon Ventress, US Army Aviation & Missile Command, earned a distinguished committee service award.

For their leadership of the D-23 subcommittee in the new revision of IPC-4103B, Specifications for Base Materials for High Speed/High Frequency Applications, Ed Sandor, Taconic Advanced Dielectric Division; and Dan Welch, Rogers Corporation, earned a committee leadership award. For their contributions to the standard revision, Mahendra Gandhi, Northrop Grumman Aerospace Systems; Scott Herrmann, Dupont Circleville; Tony Senese, Panasonic Industrial Devices Sales Company of America (PIDSA); Mamoru (Mark) Takahashi, Asahi Glass Company, Ltd.; Stephen Tisdale, Tisdale Environmental Consulting, LLC.; Chris Totten, Isola Group SARL; Jennet Volden, Rockwell Collins; and David Wynants, Taconic Advanced Dielectric Division, earned a distinguished committee service award.

For their significant contributions to the 2017-2018 IPC APEX EXPO Technical Program Committee, Bev Christian, HDP User Group; Todd MacFadden, Bose Corporation; and Stan Rak, Continental Automotive Systems, earned a special recognition award. For their contributions, Steve Butkovich, Beverley Christian, HDP User Group; Martin Goetz, Northrop Grumman Corp; Dave Hoover, TTM Technologies; Jason Keeping, Celestica; Weifeng Liu, Flextronics; Todd MacFadden, Bose Corporation; Russell Nowland, Nokia; Brook Sandy-Smith, Indium Corporation; Karl Sauter, Oracle America, Inc.; Jeff Schake, ASM Assembly Systems; Julie Silk, Keysight Technologies; Bhanu Sood, NASA Goddard Space Flight Center; and Udo Welzel, Robert Bosch GmbH, earned a distinguished committee service award.

For their leadership of the 2-18b committee that developed IPC-1752A, Amendment 3, Materials Declaration Management Standard, Mark Frimann, Texas Instruments, Inc.; and Aidan Turnbull, BomCheck, earned a committee leadership award. For their significant contributions to this standard, Dr. N Nagaraj, Papros, Inc.; and Jim Kandler, RoHS Ready, LLC, earned a special recognition award. For their contributions, Brenda Baney, B Cubed Consulting; David Carnevale, Dolby Laboratories Forrest Christian, Innovation Machine, Ltd.; Tord Dennis, WSP; Randall Flinders, GreenSoft Technology Inc; Marelle Fogel, DXC; Jason Gooden, Anthesis Group; JB Hollister, Apple, Inc.; Walter Jager, ECD Compliance; Nikki Johnson, Total Parts Plus; Kurk Kan, Bose Corporation; Jim Kandler, RoHS Ready, LLC; Chuck LePard, DXC; Dr. N Nagaraj, Papros, Inc.; Gary Schmalfeld, Raytheon; Eric Straw, Rockwell Collins; Jean-Pierre Theret, Dassault Systemes; Bryan Tran, LSI Logic Corporation; James Vetro, GE Healthcare; Larisa Vishkovetsky, Seagate Technology; Bakul Wadgoankar, Bose Corporation, Tedie West, Siemens; Michael Wurzman, RSJ Technical Consulting; and Michael Zepp, Dassault Systemes, earned a distinguished committee service award.

For their leadership of the 2-18j committee in the development of IPC-1753, Amendment 1, Laboratory Report Standard, Jason Gooden, Anthesis Group; and JB Hollister, Apple, Inc., earned a committee leadership award. For their contributions to IPC-1753, Emma Gates, Intel Corporation; William Haas, Jim Kandler, RoHS Ready, LLC.; Valerie Kuntz, Assent Compliance, Inc.; Chuck LePard, DXC; Dr. N Nagaraj, Papros, Inc.; Stacy Stannard, Bureau Veritas Consumer Products Services; Jean-Pierre Theret, Dassault Systemes; Stephen Tisdale, Tisdale Environmental Consulting, LLC.; Aidan Turnbull, BomCheck; Larisa Vishkovetsky, Seagate Technology; Bakul Wadgaonkar, Bose Corporation; Tedie West, Siemens; Michael Wurzman, RSJ Technical Consulting; Michael Zepp, Dassault Systemes, earned a distinguished committee service award.

For leadership of the D-13 Flexible Circuits Base Materials Subcommittee in the new revision of IPC-4202B, Flexible Base Dielectrics for Use in Flexible Printed Boards, Clark Webster, ALL Flex, LLC., earned a committee leadership award. For their contributions, Michael Collier, Teledyne Advanced Dielectric Solutions; Mark Finstad, Flexible Circuit Technologies, Inc.; Thomas Gardeski, Gemini Sciences, LLC.; Scott Herrmann, Dupont Circleville; Michael Jawitz, Orbital ATK; Nick Koop, TTM Technologies; John Leschisin, Minco Products, Inc.; Mark Seelhammer, Rogers Corporation; Terry Fischer, Hitachi Chemical Company America, Ltd.; Rebecca Steinbauer, ALL Flex, LLC.; and Brent Sweitzer, Multek Flexible Circuits, Inc., earned a distinguished committee service award.

For their leadership of the 5-24c Solder Alloy Task Group that developed Amendment 1 to J-STD-006C, Dave Adams, Rockwell Collins; and Jennie Hwang, H-Technologies Group, earned a committee leadership award. For their contributions, Mahendra Gandhi, Northrop Grumman Aerospace Systems; Renee Michalkiewicz, NTS – Baltimore; Tetsuro Nishimura, Nihon Superior Co., Ltd.; and Brook Sandy-Smith, Indium Corporation, earned a distinguished committee service award.

For their contributions to Printed Electronics standards, Leonard Allison, NTS – Baltimore; Sai Avuthu, Jabil Circuit, Inc.; Neil Bolding, MacDermid Enthone Electronics Solutions; Alan Brown, Engineered Materials Systems, Inc.; Alan Burk, ALMAX; Ken Gann, Lab Tech; Mary Alice Gill, Jabil Circuit, Inc.; Josh Goldberg, Taiyo America Inc.; Scott Gordon, DuPont Teijin Films; Mary Herndon, Raytheon Company; Mike Mastropietro, NextFlex; Jeffrey Parker, Insulectro; Haridoss Sarma, GO 2 Scout 4 R&T; Paul Shaw, In2Tec; Jeff Shubrooks, Raytheon Company; Richard Snogren, Bristlecone, LLC.; Hector Valladares, Honeywell Aerospace; and Steve Vetter, NSWC Crane, earned a distinguished committee service award.

For his leadership of the 7-24 subcommittee that developed IPC-9121 Amendment 1, Michael Carano, RBP Chemical Technology, Inc., earned a committee leadership award. For their contributions, Paul Cooke, TTM Technologies; Happy Holden; and Bhanu Sood, NASA Goddard Space Flight Center, earned a distinguished committee service award.

For his leadership in the development of IPC-7095D, Ray Prasad, Ray Prasad Consultancy Group; and Rob Rowland, Axiom Electronics, LLC., earned a committee leadership award. For their contributions, Dudi Amir, Intel Corporation; Raiyomond Aspandiar, Intel Corporation; Ife Hsu, Intel Corporation; Karen McConnell, Northrop Grumman Corporation; Bhanu Sood, NASA Goddard Space Flight Center; John Thompson, FCI USA, Inc., earned a distinguished committee service award.

Photos from the IPC APEX EXPO committee awards ceremonies as well as the rest of the show are available here.

About IPC

IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 4,300+ member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China. For more information, click here.

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