AIM's Oglesio Manetti Departs, Anderson Albuquerque Promoted


Reading time ( words)

AIM announces the departure of Oglesio Manetti, regional sales manager for Brazil, and the appointment of Anderson Albuquerque as technical sales manager for Brazil. 

The appointment of Anderson highlights AIM’s commitment to this important and expanding market. Anderson will use his broad technical knowledge and deep understanding of industry needs to guide customers, assist in the identification of complex problems, and support them to implement solutions.

“We are excited to offer Anderson’s ability to identify and propose technical and commercial solutions for our existing and potential customers in Brazil,” said David Suraski, AIM’s Executive Vice President, Assembly Materials Division.  “As our customer base in Brazil continues to increase, so too do our investments. We look forward to continuing to help the market implement breakthrough soldering materials and processes.”

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.

Share


Suggested Items

What SMT Component Shortages Mean for Design and Manufacturing Engineers

09/13/2018 | Russell Poppe, JJS Manufacturing
Much has been written about the increasing shortages of electronic components such as MLCCs, chip resistors and other semiconductor devices. And the manufacturing industry is now seeing price increases and greatly extended lead times. It seems the situation is likely to get rapidly worse rather than better. What can we do? Read on.

RTW NEPCON South China: Mycronic Discusses Industry 4.0

09/12/2018 | Real Time With... NEPCON South China
At the recent NEPCON South China 2018 event in Shenzhen, Clemens Jargon, VP for Global Dispensing and Asia at Mycronic, discusses I-Connect007's Edy Yu the challenges that customers face on their journey towards Industry 4.0, and how Mycronic is addressing these issues. From jet printing to solder paste inspection, to pick-and-place, Jargon talks about their total solutions that aim to help customers take their production to the next level.

Whitepaper: Electronics Cleanliness Testing

09/11/2018 | Jason Fullerton, Alpha Assembly Solutions
This paper investigates and compares the performance of no-clean liquid wave soldering fluxes using a commercially available localized extraction and cleanliness testing system, and surface insulation resistance (SIR) testing. Find out which test is suitable for your processes.



Copyright © 2018 I-Connect007. All rights reserved.