Kyzen’s Bixenman to Present at Electronics in Harsh Environments Conference


Reading time ( words)

KYZEN has announced that Dr. Mike Bixenman will present at the SMTA Electronics in Harsh Environments Conference, scheduled to take place April 24-26, 2018 at the Crowne Plaza Amsterdam.

The conference is focused on building reliable electronics that operate within harsh environments. Dr. Bixenman will present “Materials Characterization under Leadless Component Bodies,” and will discuss the results from his research to qualify and validate assembly processes as it relates to materials and cleaning using alternative test board design features to determine the risk of failure.

“This conference is a great resource for engineers of all levels,” explained Mike Bixenman. “Materials in electronics packaging continue to evolve in response to complex manufacturing and reliability requirements, particularly those that must work within aggressive operating environments.”

Experts from industry and academia will present on topics including predicting component life, solder alloys that can withstand high operating temperatures, test methods for harsh environments, electrochemical reliability and coatings. Miniaturization and environment play major roles in the electronics lifecycle. The failure mechanisms for SAC solder joints, LEDs and Electrochemical Migration will be studied and reviewed, with particular attention paid to the automotive end-use environment.

Dr. Mike Bixenman has more than 25 years of experience in the design of electronic assembly cleaning materials and process integration. He has held the position of IPC/SMTA Cleaning Symposium Chair over the last 10 years and is the current chair of the IPC Cleaning Handbook Task Group. Dr. Bixenman holds four earned degrees including a Doctorate in Business Administration.

About KYZEN

KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, click here.

Share


Suggested Items

I-Connect007 Survey Shows Rising Use of Flex and Rigid-Flex

07/24/2018 | I-Connect007 Research Team
In our recent survey on flex and rigid-flex circuits, the majority of our respondents indicated an increase in their use of flex and rigid-flex technologies in their designs, indicating a continued shift in flex technology usage. We bring you the survey details here.

Plasmatreat on Atmospheric Pressure Plasma

07/20/2018 | Barry Matties, I-Connect007
At the recent SMT Hybrid Packaging 2018 event held in Nuremberg, Germany, I-Connect007's Barry Matties sat down with Nico Coenen, global business development manager of Plasmatreat, for a discussion on Plasmatreat's atmospheric pressure plasma (AP plasma) treatment process and its various applications in the electronics industry.

Is There an End in Sight to the Electronic Components Crisis?

07/12/2018 | Neil Sharp, JJS Manufacturing
As new and innovative technology continues to evolve on a daily basis, the need for electronic components has reached unprecedented levels, with passive manufacturers in particular among those struggling to cope with demand. Electronic component shortages are now such an issue that many OEMs are predicting their forecasted growth for 2018-2019 will be thwarted if they are unable to source the parts they need.



Copyright © 2018 I-Connect007. All rights reserved.