Kyzen’s Bixenman to Present at Electronics in Harsh Environments Conference


Reading time ( words)

KYZEN has announced that Dr. Mike Bixenman will present at the SMTA Electronics in Harsh Environments Conference, scheduled to take place April 24-26, 2018 at the Crowne Plaza Amsterdam.

The conference is focused on building reliable electronics that operate within harsh environments. Dr. Bixenman will present “Materials Characterization under Leadless Component Bodies,” and will discuss the results from his research to qualify and validate assembly processes as it relates to materials and cleaning using alternative test board design features to determine the risk of failure.

“This conference is a great resource for engineers of all levels,” explained Mike Bixenman. “Materials in electronics packaging continue to evolve in response to complex manufacturing and reliability requirements, particularly those that must work within aggressive operating environments.”

Experts from industry and academia will present on topics including predicting component life, solder alloys that can withstand high operating temperatures, test methods for harsh environments, electrochemical reliability and coatings. Miniaturization and environment play major roles in the electronics lifecycle. The failure mechanisms for SAC solder joints, LEDs and Electrochemical Migration will be studied and reviewed, with particular attention paid to the automotive end-use environment.

Dr. Mike Bixenman has more than 25 years of experience in the design of electronic assembly cleaning materials and process integration. He has held the position of IPC/SMTA Cleaning Symposium Chair over the last 10 years and is the current chair of the IPC Cleaning Handbook Task Group. Dr. Bixenman holds four earned degrees including a Doctorate in Business Administration.

About KYZEN

KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, click here.

Share


Suggested Items

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.

Stencil Printing Techniques for Challenging Heterogeneous Assembly Applications

04/16/2018 | Mark Whitmore and Jeff Schake, ASM Assembly Systems
A new generation of near microscopic size SMT chip capacitors has appeared in the market, known as either 0201 or 008004. This article investigates and characterizes the stencil printing process for compatibility with M0201 capacitor assembly. Effects of circuit board quality, stencil thickness, and stencil nano-coating are evaluated against solder paste volume transfer efficiency and raw-volume print distribution.

Why AOI is a Must-have for PCB Assembly

04/05/2018 | Russell Poppe, JJS Manufacturing
AOI has an invaluable role to play in speeding up the process of PCB production, in ensuring extreme precision to catch even the smallest of defects, and in minimizing the potential for time-consuming and costly reworking.



Copyright © 2018 I-Connect007. All rights reserved.