Rehm to Demo Innovative Equipment at NEPCON Shanghai


Reading time ( words)

Rehm Thermal Systems will once again be represented at NEPCON Shanghai, the leading trade fair for the Asian electronics manufacturing market. The latest systems engineering, innovative software solutions and competent process consulting await you from April 24-26, 2018 at our stand 1F20.

We will present the following at NEPCON Shanghai: 

VisionXP+ Vac: The 2-in-1 solution for convection reflow soldering

The VisionXP+ convection soldering system combines various advances in technology, particularly with regard to energy efficiency optimisation and emissions reduction. It allows customers to reduce energy use in electronics manufacture by up to 20% and consumes on average 10 tonnes less CO2 per year. For the first time ever, the vacuum option makes it possible for convection soldering to take place with or without a vacuum – in one system! The VisionXP+ Vac reliably removes gas cavities and voids during the soldering process, while the solder is still in its optimum molten state. With a vacuum pressure of up to 2 mbar, void rates of less than 2% can be achieved.

condenso.jpgCondensoXC: Compact structure – huge performance

The CondensoXC, designed for reliable condensation soldering, has a compact structure thanks to its innovative processing chamber. And it performs in a big way. With its patented injection principle, the exact amount of Galden® required is added to the process for optimal profiling. The closed-loop filter system allows almost 100% of the medium to be regained and filtered. The system is completely suitable for vacuums and has an integrated process recorder for maximum traceability. 

software.jpgViCON: Smarter Software for more efficiency

Rehm has developed with ViCON an innovative solution for easy operability and optimal traceability in the VisionX series. The software can, for example, monitor all values that have changed, or collect and statistically evaluate alarms in order to avoid errors and to optimize machine settings.

About Rehm Thermal Systems

As a specialist in the field of thermal system solutions for the electronics and photovoltaics industries, Rehm is a technology and innovation leader in the modern and economical production of electronic modules. As a globally operating manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for the metallization of solar cells as well as numerous customer-specific special systems, we are represented in all relevant growth markets and, as a partner with more than 25 years of industry experience, we implement innovative manufacturing solutions that set standards.

Share


Suggested Items

Jigar Patel on ZESTRON’s Reliability Solutions for Class 3 Assemblies

06/14/2018 | Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.

Elements to Consider on BGA Assembly Process Capability

06/05/2018 | Dora Yang, PCBCart
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.

RTW NEPCON China: Armada Discusses Impact of Auto Electrification on PCB Assembly

06/01/2018 | Real Time with... NEPCON China
At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.



Copyright © 2018 I-Connect007. All rights reserved.