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ZESTRON will present at the Soldering, Cleaning and Coating Workshop with Arbell, Alpha Assembly Solutions, Aqueous Technologies, and MG Chemicals. This free, collaborative workshop will be held on Tuesday, April 17, 2018 in Vancouver, Canada.
Jason Fullerton, Customer Technical Support Engineer from Alpha Assembly Solutions, will present, "No Clean Fluxes – Why and When Should They Be Cleaned?" This presentation will describe the IPC classifications used to describe the properties of fluxes and the requirements that need to be met to be called a 'no-clean flux.' A comparison of the benefits and drawbacks of no clean fluxes to older technology RMA fluxes and modern water soluble fluxes will be discussed.
Second, Mike Konrad, President, Aqueous Technologies, will present "Contamination Associated Failure Mechanisms and How to Avoid Them." This presentation will provide valuable information about contamination related failure mechanisms.
After a complimentary lunch, Jigar Patel, M.S.Ch.E., Senior Application Engineer, ZESTRON Academy, will present "PCB Reliability with QFNs and No Clean Fluxes." This presentation will discuss the need to clean no-clean fluxes and will review a case study validating cleaning process parameters needed for cleaning underneath bottom termination components.
Lastly, Kai Hui, VP of Business Development, MG Chemicals, will present "Material Selection and Application for Ruggedization of Electronics." This presentation will examine factors considered in selecting and applying potting, encapsulating, and coating materials for ruggedization of electronics.