Reading time ( words)
SMTA Europe announces the Professional Development Course on Increasing the Performance of Organic PCBs at Higher Temperatures being at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 24 2018.
Martin Wickham of the National Physical Laboratory (NPL) will teach the course focused on Increasing the Performance of Organic PCBs at Higher Temperatures. Power Electronics demand high temperature interconnected solutions at the circuit board level. Application areas for these devices include electric vehicles, renewable energy, avionics and oil & gas.
Wickham will introduce the combination of performance improvements that comprise components, interconnects and substrates. He will teach performance enhancements required in interconnection materials to operate reliability in these harsher environments.
Come learn best practices for building reliable assemblies that can withstand high temperature and harsh environments.
02/07/2018 | Pete Starkey, I-Connect007
Pete Starkey spent a few minutes at the SuperDry booth on the first day of the productroncica show, and chatted with old friend Rich Heimsch, who taught the old dog a few new tricks about the drying process.
10/31/2017 | Stephen Las Marias, I-Connect007
In an interview with SMT Magazine, Enrique Moreno, technical support engineer at JBC Soldering, discusses the key parameters to consider during hand soldering to achieve the perfect solder joint. He also talks about the the increasing move towards automation and robotics soldering.
10/09/2017 | Bob Wettermann, BEST Inc.
Higher reflow temperatures of lead-free rework increases the pressure for properly shielding the neighboring components. These developments are causing BGA rework challenges. This summary will discuss the most challenging aspects of BGA rework and options for solutions.