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Designed for the highly flexible mid-speed markets, high mix and prototype productions, ASM Assembly Systems’ E by DEK and E by SIPLACE printing and placement platforms set totally new standards in terms of quality, performance and modularity. To further improve the E solutions based on customer feedback, ASM is adding new features and options to the said platforms this year.
For the E by DEK, new options such as the DEK Interchangeable Understencil Cleaner and the DEK Adjustable-Width Stencil Mount allow for more automated cleaning as well as easier and faster stencil changeover.
Meanwhile, the E by SIPLACE adds the Odd-Shape Component Package for the smart placement of large, bulky components and connectors. Additionally, the E by SIPLACE Ease of Use package makes regular tasks such as tray teaching, handling of dirty or defect nozzles, and face-down recognition of diodes much more efficient.
I-Connect007 Editorial Team
In this interview, Jason Fullerton of Alpha Assembly Solutions discusses the benefits and challenges of low-temperature soldering. He also highlights the biggest concerns he’s currently seeing in the industry, including young engineers lacking hands-on manufacturing experience and training, voiding and head-in-pillow issues, and low-temperature soldering demands.
Ranjit Pandher, et al., Alpha Assembly Solutions
Solder voiding is a common phenomenon across all semiconductor packaging and electronic board assemblies. There are many factors that influence void frequency and size. This article focuses on several process, design and materials selection considerations which control or potentially reduce voiding to meet industry and end-market acceptance criteria.
Traian C. Cucu, Alpha Assembly Solutions, and Ioan Plotog and Mihai Branzei, Politechnica University of Bucharest
This article examines the performance of two low melting point SnBi alloys used in solder paste when assembling BGA components with SAC alloy spheres, and the advantages of a low-temperature process over the regular SAC assembly process. It will also evaluate solder paste capability regarding the process and the performance of a joint formed with a low melting point alloy solder paste and SAC305 spheres, including process advantages and material capabilities.