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Designed for the highly flexible mid-speed markets, high mix and prototype productions, ASM Assembly Systems’ E by DEK and E by SIPLACE printing and placement platforms set totally new standards in terms of quality, performance and modularity. To further improve the E solutions based on customer feedback, ASM is adding new features and options to the said platforms this year.
For the E by DEK, new options such as the DEK Interchangeable Understencil Cleaner and the DEK Adjustable-Width Stencil Mount allow for more automated cleaning as well as easier and faster stencil changeover.
Meanwhile, the E by SIPLACE adds the Odd-Shape Component Package for the smart placement of large, bulky components and connectors. Additionally, the E by SIPLACE Ease of Use package makes regular tasks such as tray teaching, handling of dirty or defect nozzles, and face-down recognition of diodes much more efficient.
Russell Poppe, JJS Manufacturing
Much has been written about the increasing shortages of electronic components such as MLCCs, chip resistors and other semiconductor devices. And the manufacturing industry is now seeing price increases and greatly extended lead times. It seems the situation is likely to get rapidly worse rather than better. What can we do? Read on.
I-Connect007 Editorial Team
The continuing growth of the electronics industry, driven by the rapid expansion of electronics into areas such as automotive and medical, is creating a new mindset with regard to cleaning, mainly due to quality and reliability issues. Read more to find out what our experts have to say when it comes to cleaning challenges in PCBAs and possible solutions.
Barry Matties, I-Connect007
Stefan Theil, product manager at Factronix, discusses the growing need for cleaning in European electronics manufacturing and the demands he's facing from customers when it comes to finer pitches, automation, and environmental concerns.