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Designed for the highly flexible mid-speed markets, high mix and prototype productions, ASM Assembly Systems’ E by DEK and E by SIPLACE printing and placement platforms set totally new standards in terms of quality, performance and modularity. To further improve the E solutions based on customer feedback, ASM is adding new features and options to the said platforms this year.
For the E by DEK, new options such as the DEK Interchangeable Understencil Cleaner and the DEK Adjustable-Width Stencil Mount allow for more automated cleaning as well as easier and faster stencil changeover.
Meanwhile, the E by SIPLACE adds the Odd-Shape Component Package for the smart placement of large, bulky components and connectors. Additionally, the E by SIPLACE Ease of Use package makes regular tasks such as tray teaching, handling of dirty or defect nozzles, and face-down recognition of diodes much more efficient.
Mark Whitmore and Jeff Schake, ASM Assembly Systems
A new generation of near microscopic size SMT chip capacitors has appeared in the market, known as either 0201 or 008004. This article investigates and characterizes the stencil printing process for compatibility with M0201 capacitor assembly. Effects of circuit board quality, stencil thickness, and stencil nano-coating are evaluated against solder paste volume transfer efficiency and raw-volume print distribution.
Ken Horky, Peterson Manufacturing
Electronic assembly thermal management has always been an issue but has become more significant as we pack more power and function into a smaller form factor. In recent years, the growing use of LEDs for illumination on a large scale has presented additional thermal demands.
Stephen Las Marias, I-Connect007
Aculon Inc. commercializes unique surface coatings leveraging nanotechnology and other surface modification techniques. The company’s original focus was the optical industry, developing treatments of prescription eyewear, sunglasses and other optics.