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SMTA Europe: Electronics in Harsh Environments Conference, Session 4
April 13, 2018 | SMTAEstimated reading time: 1 minute
SMTA Europe announces Session 4 Technical Program on Electrochemical Reliability at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25, 2018.
There is mounting evidence that as PCB component density increases, so does the sensitivity of the circuit to ionic contamination. There have been many industry examples where manufacturers have relied on ionic contamination testers, yet still had product that failed in service. Both OEMs and EMS companies need improved methods for developing “Objective Evidence” centered on the concept of a Qualified Manufacturing Process. To address this issue, Doug Pauls from Rockwell Collins will present an overview on Global Change in Ionic Cleanliness Requirements.
Removal of process residues is a common practice to reduce electrochemical interactions. The use of miniaturized components may violate minimum electrical clearance for devices exposed to harsh environments. Mike Konrad of Aqueous Technologies will present on cleanliness requirements needed to improve the reliability of printed circuit assemblies
In highly humid environments, there is a greater concern on electronics robustness and signal integrity. Due to the need to reduce the power consumption of electronic modules, switching thresholds within high humidity environments decrease, which increases the propensity for leakage currents. Dr. Helmut Schweigart of Zestron, in collaboration with leading automotive tier 1 suppliers, will present research that allows an OEM to calculate switching threshold data on active devices that are exposed to harsh environments.
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Marcy's Musings: The Growing Industry
04/16/2024 | Marcy LaRont -- Column: Marcy's MusingsAfter decades of steady decline in the U.S. and Europe, the PCB industry is finally growing, especially in China Plus One countries. The U.S. for example, which seemed to have abdicated its title as the world leader in innovating high-technology cutting-edge manufacturing processes, is now in a race to regain what it lost and then some. The PCB fabrication industry is growing in the West, thanks to DoD funding, the CHIPS and Science Act, and hopefully, the passing of HR 3249, the Printed Circuit Board and Substrates Act.
FTG Announces Q1 2024 Financial Results
04/12/2024 | Firan Technology Group CorporationDuring Q1 2024, the Corporation has continued to invest in technology in existing sites, grow the business organically, and integrate the two acquisitions completed last year. FTG is strategically deploying its capital in ways that will drive increased shareholder returns for the future in both the near term and long term. Specifically, FTG accomplished the following in Q1 2024, which continues to improve the Corporation and position it for the future:
An Ultimate Goal in Sustainability: Recyclable PCBs
04/11/2024 | Marcy LaRont, PCB007 MagazineWho doesn’t believe in recycling? “Re-use, repurpose, recycle” has been a drumbeat for more than two decades. Our children learn about it in primary school. Full university departments devoted to environmental science and sustainability in universities forward their discipline for the world's benefit. In theory, we all get behind the concept of recycling, even if the nuances of execution may fall short.
DuPont Unveils Pyralux ML Laminate Series, Offering High Thermal Management for Extreme Environments
04/09/2024 | DuPontDuPont introduced the DuPont™ Pyralux® ML Series of double-sided metal-clad laminates, a unique addition to its extensive family of Pyralux® laminates for flexible and rigid-flex printed circuit boards (PCBs).