International Conference for Electronics Enabling Technologies Program Finalized

Reading time ( words)

SMTA is excited to announce the technical program has been finalized and registration is now open for the International Conference for Electronics Enabling Technologies. The event will be held June 5-7, 2018 in Markham, Ontario, Canada.  

Five Professional Development Courses will be held on Tuesday, June 5. Two courses are scheduled for the morning: “Interconnections: PCB and Solder – Not Just Your Normal Failure Modes Any More” and “Stencil Printing – Intermediate Topics: Process Troubleshooting and Defect Prevention.” Three courses are slated for the afternoon: “Failure Analysis of Electronic Devices”, “Understanding Shock & Vibration”, and “Robust Coating Processes in the Factory: Methods, Critical Parameters, Problems and Remedies.”

Conference sessions on June 6 and 7 will cover Failure Modes, Reliability, Research from the Refined Manufacturing Acceleration Process (ReMAP) Consortium, Coating & Encapsulation, Imaging & Inspection, Solder and Solder Paste. A panel discussion on "Warpage Induced Defects and Component Warpage Limits" is organized for Wednesday with experts from Plexus, Rockwell Collins, and Akrometrix. Thursday’s panel on "Low Melting Point Solder Pastes" will feature experts from Indium Corporation, Alpha Assembly Solutions, and Nihon Superior.

Shawn Blakney, Senior Director of Global Technology and Innovation at Celestica, will provide the keynote presentation on Tuesday, June 5 on the topic of “The Automated and Digital Factory - Navigating Technology Disruption.”

The conference is co-located with the SMTA Ontario Expo on Wednesday, June 6, featuring 20 companies highlighting the latest manufacturing solutions.

The forerunner conference of ICEET, the International Conference for Solder and Reliability (ICSR), grew to be a premier technical conference for all aspects of solders, metallurgy and the solder interconnect process, through the period of conversion to lead-free solder, driven by RoHS and WEEE. The ICEET Technical Committee intends to continue the tradition of technical excellence, and broaden the scope to the wider enabling technologies, including design for assembly, test and reliability (DfX), packaging, assembly challenges for high density PCBs and components, potting and other methods to achieve high reliability in aggressive environments.

About SMTA – A Global Association Working at a Local Level

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

For more information, click here.


Suggested Items

Tips to Improve Soldering Tip Life and Reduce Cost

10/10/2018 | Thermaltronics
Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.

What SMT Component Shortages Mean for Design and Manufacturing Engineers

09/13/2018 | Russell Poppe, JJS Manufacturing
Much has been written about the increasing shortages of electronic components such as MLCCs, chip resistors and other semiconductor devices. And the manufacturing industry is now seeing price increases and greatly extended lead times. It seems the situation is likely to get rapidly worse rather than better. What can we do? Read on.

RTW NEPCON South China: Mycronic Discusses Industry 4.0

09/12/2018 | Real Time With... NEPCON South China
At the recent NEPCON South China 2018 event in Shenzhen, Clemens Jargon, VP for Global Dispensing and Asia at Mycronic, discusses I-Connect007's Edy Yu the challenges that customers face on their journey towards Industry 4.0, and how Mycronic is addressing these issues. From jet printing to solder paste inspection, to pick-and-place, Jargon talks about their total solutions that aim to help customers take their production to the next level.

Copyright © 2018 I-Connect007. All rights reserved.