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AIM Solder is pleased to announce that Dr. Mehran Maalekian, Research & Development Director, will present at the SMTA Electronics in Harsh Environments Conference taking place April 24-26, 2018 at the Crowne Plaza Amsterdam in Schiphol, Netherlands.
Dr. Maalekian will share his extensive knowledge of solder alloys used in harsh service environments such as high power LED and automotive under-hood applications. Sn/Ag/Cu (SAC) alloys have demonstrated unstable mechanical performance and are not adequately reliable for high thermal stress applications. In this work a novel high reliability SAC base alloy with added alloying and micro-alloying elements, REL22™, is presented. By comparing thermal, mechanical, wetting properties of REL22 against reference SAC, it is explained why REL22 with greater strength and stable creep properties possesses superior thermal fatigue resistance and mechanical properties as compared to SAC305 and other SAC and low silver alloys.
About Dr. Maalekian
Dr. Maalekian is experienced in materials engineering with a focus on physical metallurgy, soldering, modeling in materials engineering, metal forming and thermo-mechanical processes. Dr. Maalekian has received numerous recognitions including the National Sciences and Engineering Research Council of Canada Award, the International Henry Granjon Prize (IIW), and IWS-Sossenheimer Award. He has been awarded the honor of Speaker of Distinction by the Surface Mount Technology Association (SMTA). Dr. Maalekian has published many scientific and technical papers, serves as a reviewer of several scientific journals, and is on the editorial board of “Science and Technology of Welding and Joining.”