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AIM Solder is pleased to announce that Dillon Zhu, Regional Technical Support Manager, will present at the SMTA China East Technical Conference taking place April 24-26, 2018 at the Shanghai World Expo Exhibition & Convention Center.
Mr. Zhu will present the results of an AIM study examining the effect of QFN I/O paste deposits on ground pad voiding. BTCs have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations and ground/thermal pads create a number of challenges, including tilting, poor solder fillet formation, difficult inspection and – most notably – center/ground pad voiding. Voids in ground pad solder joints can be difficult to control due to the variety of input variables that can influence their formation. Most of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
You can attend Mr. Zhu’s technical discussion on Tuesday, April 24, 2018 from 11:40-12:15 in Room No. 6, B2 at the conference.
About Dillon Zhu
Dillon Zhu is Regional Technical Support Manager for AIM and, with over 15 years of experience, is an expert in SMT manufacturing. Since joining AIM in 2008, he has assisted many clients in diagnosing and correcting SMT and wave solder production challenges.