iNEMI Co-Hosts Session at SMTA Europe’s Harsh Environments Conference


Reading time ( words)

The Electronics in Harsh Environments Conference (24-26 April), sponsored by SMTA Europe, tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments (elevated operating temperatures, high humidity, vibration and more).

iNEMI is co-hosting the final session of the conference (26 April), which will focus specifically on automotive electronics. This session includes an interactive discussion with the following panel of experts:

  • Dr. Lothar Henneken, Robert Bosch GmbH
  • Craig Hillman, DfR
  • Brook Sandy-Smith, Indium 

The three-day conference will also cover topics such as reliable high-density assemblies, power electronics, electric hybrids, product assembly challenges, cleaning, coating, process control, and monitoring and tracking production hardware. Challenging areas such as high-temperature soldering, solder material advances, and new standards will also be addressed.

Share

Print


Suggested Items

IPC APEX EXPO 2020 Attendees Speak: Dr. Martin Anselm

02/14/2020 | I-Connect007 Editorial Team
"The biggest challenge I’ve encountered a number of different times is the migration to much larger packaging," said Dr. Martin Anselm, director of CEMA Lab. "Devices are getting much larger, and with the thousands of I/O of solder joints, and they are not just single-die, multi-chip modules in different forms or 2.5D technologies. Further, there are challenges associated with soldering. How do we go away from traditional soldering technologies or methodologies where these devices are so complex that warpage or alloy or reliability is driving us into unknown territories with soldering methodologies?

LPKF on Stencils and Depaneling

02/11/2020 | I-Connect007 Editorial Team
Stephan Schmidt and Mirela Orlowski of LPKF Laser & Electronics North America discuss laser technology in cutting stencils and depaneling circuit boards as a factor in shrinking component sizes and why few people in the industry realize how much of an impact the stencil can have on the manufacturing line.

Clean vs. No-clean: A Generational Difference

12/24/2019 | Barry Matties, I-Connect007
Tom Forsythe, executive VP of KYZEN, discusses what readers should know about cleaning as reliability expectations continue to increase. He also explains what is driving the new interest in cleaning and why engineers from the no-clean generation may not even realize they need to learn more about cleaning.



Copyright © 2020 I-Connect007. All rights reserved.