iNEMI Co-Hosts Session at SMTA Europe’s Harsh Environments Conference


Reading time ( words)

The Electronics in Harsh Environments Conference (24-26 April), sponsored by SMTA Europe, tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments (elevated operating temperatures, high humidity, vibration and more).

iNEMI is co-hosting the final session of the conference (26 April), which will focus specifically on automotive electronics. This session includes an interactive discussion with the following panel of experts:

  • Dr. Lothar Henneken, Robert Bosch GmbH
  • Craig Hillman, DfR
  • Brook Sandy-Smith, Indium 

The three-day conference will also cover topics such as reliable high-density assemblies, power electronics, electric hybrids, product assembly challenges, cleaning, coating, process control, and monitoring and tracking production hardware. Challenging areas such as high-temperature soldering, solder material advances, and new standards will also be addressed.

Share


Suggested Items

Alpha Assembly Solutions on Training, Education, and Low-Temperature Soldering

11/07/2018 | I-Connect007 Editorial Team
In this interview, Jason Fullerton of Alpha Assembly Solutions discusses the benefits and challenges of low-temperature soldering. He also highlights the biggest concerns he’s currently seeing in the industry, including young engineers lacking hands-on manufacturing experience and training, voiding and head-in-pillow issues, and low-temperature soldering demands.

Process, Design and Material Factors for Voiding Control for Thermally Demanding Applications

11/06/2018 | Ranjit Pandher, et al., Alpha Assembly Solutions
Solder voiding is a common phenomenon across all semiconductor packaging and electronic board assemblies. There are many factors that influence void frequency and size. This article focuses on several process, design and materials selection considerations which control or potentially reduce voiding to meet industry and end-market acceptance criteria.

I-Connect007 Survey: Inspection Systems to See Increasing Use of 3D Technology

10/31/2018 | Stephen Las Marias, I-Connect007
There is a critical need for inspection in the PCB assembly industry amid the continuing trend towards miniaturization in electronic systems and devices. Further, as solder joints become smaller and fine pitch becomes denser, the use of 3D technologies in inspection systems is becoming a must to help improve the quality and reliability of tests.



Copyright © 2018 I-Connect007. All rights reserved.