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The Electronics in Harsh Environments Conference (24-26 April), sponsored by SMTA Europe, tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments (elevated operating temperatures, high humidity, vibration and more).
iNEMI is co-hosting the final session of the conference (26 April), which will focus specifically on automotive electronics. This session includes an interactive discussion with the following panel of experts:
- Dr. Lothar Henneken, Robert Bosch GmbH
- Craig Hillman, DfR
- Brook Sandy-Smith, Indium
The three-day conference will also cover topics such as reliable high-density assemblies, power electronics, electric hybrids, product assembly challenges, cleaning, coating, process control, and monitoring and tracking production hardware. Challenging areas such as high-temperature soldering, solder material advances, and new standards will also be addressed.
Barry Matties, I-Connect007
At the recent SMT Hybrid Packaging 2018 event held in Nuremberg, Germany, I-Connect007's Barry Matties sat down with Nico Coenen, global business development manager of Plasmatreat, for a discussion on Plasmatreat's atmospheric pressure plasma (AP plasma) treatment process and its various applications in the electronics industry.
Barry Matties and Stephen Las Marias, I-Connect007
William Yu, senior technical services manager for Alpha Assembly Solutions, recently shared with I-Connect007 the challenges when it comes to the reliability of low-temperature solder pastes, and soldering strategies to overcome these issues.
Stephen Las Marias, I-Connect007
Jason Michaud, a 19-year veteran at Miraco Inc., is the company’s new vice president of sales. In an interview with SMT007 Magazine, Jason speaks about the factors driving the increasing utilization of flexible printed circuits, the challenges in flex circuit assembly, and the best practices to address those issues.