Indium’s Greg Wade Earns IPC Leadership Award


Reading time ( words)

Indium Corporation’s Greg Wade, technical support engineer, Global Accounts, was presented with the Committee Leadership Award by the IPC in recognition of his excellence in leadership in the development of the industry standard IPC-7526A, Stencil and Misprinted Board Cleaning Handbook.

Wade provides global technical support for Indium Corporation’s multi-national customers. He is an expert in surface mount and through-hole technologies and has more than 20 years of experience working with a number of electronics manufacturers and suppliers throughout the world. Wade is a veteran of the United States Navy and is educated in aviation RF electronics. He earned his Six Sigma Green Belt, as well as certifications on numerous equipment sets. He also holds several patents for tooling design.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

Share


Suggested Items

Plasmatreat on Atmospheric Pressure Plasma

07/20/2018 | Barry Matties, I-Connect007
At the recent SMT Hybrid Packaging 2018 event held in Nuremberg, Germany, I-Connect007's Barry Matties sat down with Nico Coenen, global business development manager of Plasmatreat, for a discussion on Plasmatreat's atmospheric pressure plasma (AP plasma) treatment process and its various applications in the electronics industry.

Is There an End in Sight to the Electronic Components Crisis?

07/12/2018 | Neil Sharp, JJS Manufacturing
As new and innovative technology continues to evolve on a daily basis, the need for electronic components has reached unprecedented levels, with passive manufacturers in particular among those struggling to cope with demand. Electronic component shortages are now such an issue that many OEMs are predicting their forecasted growth for 2018-2019 will be thwarted if they are unable to source the parts they need.

It’s Time to Retire ROSE Testing

06/27/2018 | Joe Russeau, Precision Analytical Laboratory, and Mark Northrup, IEC Electronics
Over the last two to three years, there has been considerable discussion within various IPC committees about the role of the ROSE test in today's assembly environment. The transition from predominantly water wash processes to "no clean" has meant the advent of very different flux compositions. The question has been posed as to whether the ROSE test is still a viable option for evaluating PCB and PCBA cleanliness.



Copyright © 2018 I-Connect007. All rights reserved.