TopLine Sees Growing Interest in CCGAs at NEPCON China


Reading time ( words)

TopLine exhibited at the recent NEPCON China conference and exhibition in Shanghai and noted a number of significant new directions in thinking with regard to component reliability, quality, and thermal management issues.

”There is growing Interest in CCGA column grid array packages in China,” states Martin Hart, TopLine’s CEO. “It's about reliability. I was impressed by the number of prospective customers visiting the TopLine booth who were seeking increased reliability by selecting CCGA packages because of the CCGA's ability to reduce stress directly caused by CTE mismatch.”

Participation in the show was TopLine's fifth straight year at NEPCON China in Shanghai. Featured products included CCGA column grid arrays and daisy chain BGA test vehicles. 

TopLine’s CCGA column grid array IC packages are made with non-collapsible high-temperature solder columns for SMT soldering on PCBs. CCGA packages provide more compliance than BGA solder balls (ball grid arrays) to absorb stress caused by CTE mismatch and increase solder joint reliability under harsh operating conditions. 

In addition, Hart noted an encouraging trend in improved perspective among electronics assemblers and packagers in China, in that “China continues to show evidence of migration away from copying low-end products. Instead, they're progressing toward producing high reliability systems.” Increasing knowledge about the benefits of solder columns and how to incorporate them into current and future products will aid this progress, Hart concludes. TopLine has been active in promoting its products in the China market for more than 20 years. 

About TopLine

TopLine manufactures a wide range of daisy chain test components, column grid arrays, Particle Impact Vibration Dampers and engineering evaluation kits for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers. For more information, click here.

Share

Print


Suggested Items

Industry Outlook from IPC's Sharon Starr

03/18/2019 | Patty Goldman, I-Connect007
Sharon Starr, IPC's director of market research, provides updates on the EMS and PCB industry outlook, benefits of IPC membership and participation, plans to expand the EMS statistical program, and new studies being published.

RTW IPC APEX EXPO 2019: Reducing Voiding in Reflow Soldering

03/06/2019 | Real Time with...IPC
Chris Nash, product manager for PCB assembly solder paste at Indium Corporation, speaks with Kelly Dack and highlights Indium’s take on three important aspects of reliability: thermal, mechanical, and electrical. He talks about challenges of all three aspects, which include solder voiding, and how Indium helps the industry address these issues through its solder paste formulations.

Two Full CFX Demo Lines at IPC APEX EXPO 2019

03/05/2019 | Dan Feinberg, Technology Editor, I-Connect007
During IPC APEX EXPO, Editor Dan Feinberg spoke with David Bergman, IPC VP of standards and technology, about CFX, IPC’s Connected Factory Exchange software for machine-to-machine communication. With more than companies now supporting CFX, IPC set up two full lines for demonstration at the show.



Copyright © 2019 I-Connect007. All rights reserved.