Dr. Jennie Hwang to Discuss Defects Prevention at SMT Hybrid Packaging 2018


Reading time ( words)

Under today's manufacturing and market environment, the effort to maximize production yield, reduce cost and assure product reliability is becoming increasingly important to a company’s competitiveness. Considering  the new and anticipated developments in packaging and assembly and with the goal of achieving high yield and reliability in mind, the “how-to” prevent prevailing production defects and product reliability issues through an understanding of potential causes is a necessity.

On Wednesday, June 6, Tutorial 7 at SMT Hybrid Packaging 2018 Conference, Nuremberg, Germany will address the top seven production defects and reliability issues - PCB pad cratering (vs. pad lifting); BGA head-on-pillow defect; open or insufficient solder joints; copper dissolution issue; lead-free through-hole barrel filling; intermetallic compounds; and Tin Whisker. Specific defects associated with BTCs and PoPs and the reliability of BTC and PoP assembly will also be outlined.

The course addresses the most prevalent production issues and defects that affect yield, cost and reliability, suitable to all who are involved with or interested in SnPb and Pb-free manufacturing including designers, engineers, researchers, managers and business decision makers; also is designed for those who desire the broad-based information.

Please join your industry colleagues in this tutorial the main topics to be covered are listed below:

Main Topics:

  • Premise of production defects and product failure prevention;
  • The list of common production defects and issues in lead-free assembly;
  • Product reliability – principles;
  • Product reliability – solder joint, PCB and component considerations; 
  • PCB pad cratering (vs. pad lifting) — causes and solutions;                  
  • Open or insufficient solder Joints – different sources, best practices;    
  • BGA head-on-pillow defect — causes, factors, remedies;                     
  • Copper dissolution - process factors, impact on through-hole joint reliability, mitigation;
  • Lead-free through-hole barrel filling — material, process and solder joint integrity
  • Defects of BTC and PoP solder joints - prevention and remedies;                                    
  • Intermetallic compounds – fundamentals, characteristics;                                                      
  • Intermetallic compounds – effects on failure mode, solder joint reliability;                     
  • Tin whisker - applications of concern, practical criteria, testing challenges;                        
  • Tin whisker - growth phenomena, contributing factors, risk mitigation, practical remedies;
  • Summary  

To register, click here.

                                                                                                                                                          

Share


Suggested Items

Manufacturability: Pad Relief and Mask Relationship to Solder Joint Volume

03/09/2018 | Ken Horky, Peterson Manufacturing
Electronic assembly thermal management has always been an issue but has become more significant as we pack more power and function into a smaller form factor. In recent years, the growing use of LEDs for illumination on a large scale has presented additional thermal demands.

PCB Pad Repair Techniques

01/08/2018 | Bob Wettermann, BEST Inc.
There are a variety of reasons behind pads getting "lifted" completely or partially from the laminate of a PCB. Per the just revised IPC-A-610 Revision G, a defect for all three classes occurs when the land is lifted up one or more pad thicknesses. Lifted pads can occur when a device has been improperly removed or there is a manufacturing defect in the board construction. In any case, as with any repair, the ultimate decision on the ability to repair the pad lies with the customer.

Focus on the New

01/05/2018 | Stephen Las Marias, I-Connect007
It seems like it wasn't too long ago when I was writing about the optimism of the electronics manufacturing and assembly industry going into 2017. Now, here we are again at the beginning of the new year, looking at new trends, disruptive technologies, and emerging markets for 2018. I am also proud to announce our new branding as well as our fresh, new look.



Copyright © 2018 I-Connect007. All rights reserved.