Koh Young America Participating at the eSMART Factory Conference


Reading time ( words)

Koh Young is synonymous with innovative, pioneering technologies and its efforts to advance Industry 4.0 solutions further demonstrate its dedication. Recently, it has revealed smarter, faster technologies integrated with its AI-powered KSMART platform to help enable a smart factory.

From statistical process control with SPC@KSMART to instant program refinements with OPO@KSMART (Offline Programming Optimizer), Koh Young will discuss how its new AI Platform intelligently applies real-time data to improve the production process. Beyond its comprehensive KSMART factory solutions, KSMART Process Optimizer (KPO) focuses on the print process. “Comprised of multiple modules, KPO allows the Koh Young Solder Paste Inspection (SPI) system to adjust print process parameters by exercising complex machine-learning algorithms,” said Brent Fischthal, Sr Manager for Americas Marketing and Regional Sales at Koh Young America. “The KSMART software suite makes highly-regarded equipment even more powerful, while laying the foundation for a Smart Factory.” 

Learn about how the latest Koh Young technologies can help manufacturers reduce factory and machine downtime and improve throughput and first pass yield at the eSMART Factory Conference where leading technologists and engineers present, discuss, and debate the future of Industry 4.0 technologies.

eSMART Factory will be held on May 24th, 2018 at the Plug ‘n Play Center in Sunnyvale, CA, USA. This inaugural event will bring together the key technologies shaping the electronics manufacturing industry and addressed by EMS companies, OEMs, and Contract Manufacturers. Emerging technologies such Artificial Intelligence (AI), Deep Learning (DL), and Machine-to-Machine (M2M) communication will presented by leading thought leaders in our industry.

Global SMT & Packaging magazine and SMTA jointly organized the eSMART Factory conference. Global SMT & Packaging is an imprint of Trafalgar Publications and is the leading international electronics manufacturing publication with magazines, websites, newsletters, and video channels across Europe, Asia, and the Americas. SMTA (Surface Mount Technology Association) is the leading global trade association for engineers, scientists, and technologists in the field of electronics manufacturing.

We welcome conference attendees to visit our booth and understand why so many manufacturers turn to Koh Young to handle inspection challenges.

About Koh Young Technology Inc.

Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, China, and the United States. These local facilities ensure it maintains close contact with its growing customer base, while providing them with access to a global network of experts. For more information, click here.

Share


Suggested Items

Solving Reliability and Thermal Management Challenges in Automotive Electronics

05/01/2018 | Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.

Stencil Printing Techniques for Challenging Heterogeneous Assembly Applications

04/16/2018 | Mark Whitmore and Jeff Schake, ASM Assembly Systems
A new generation of near microscopic size SMT chip capacitors has appeared in the market, known as either 0201 or 008004. This article investigates and characterizes the stencil printing process for compatibility with M0201 capacitor assembly. Effects of circuit board quality, stencil thickness, and stencil nano-coating are evaluated against solder paste volume transfer efficiency and raw-volume print distribution.



Copyright © 2018 I-Connect007. All rights reserved.