-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Rehm Showcases Innovations at SMT Hybrid Packaging 2018
May 18, 2018 | Rehm Thermal SystemsEstimated reading time: 5 minutes
Every year, SMT Hybrid Packaging addresses current topics related to electronics manufacturing and puts these in the focus of the event. This year, it is all about the ever-growing field of digitalization, the fourth industrial revolution, and smart factory.
At the upcoming SMT Hybrid Packaging 2018 show in June 5–7, Rehm Thermal systems will be presenting innovative solutions for augmented reality that are an important part of the new ViCI virtual communication interface for the ViCON system software. Visitors can experience the first demo version of this innovative portal solution live in Rehms stand at Hall 4A Booth 100.
For a long time, it was common practice to always showcase the latest systems technology of the manufacturing equipment at the leading trade fairs for electronics manufacturing. These days, software solutions belonging to SMT manufacturing are playing an ever-increasing role.
Usability, flexible working and increased transparency are the main focus here. Within the field of reflow soldering systems, the need to provide corresponding data for digitalized processes is an absolute must today. With the introduction of the new ViCON system software, Rehm has created optimal conditions for ever more advanced networking between the systems. It is possible to work in a flexible manner thanks to the ViCON Connect software tool, which controls and monitors all Rehm systems within a company network, and the ViCON app for mobile access to all relevant system information. But what do the customers require of a modern software solution? Numerous conversations have made it very clear what moves our users. Concrete support with the help of data glasses, guided maintenance scenarios on tablet or smartphone as well as a comprehensive and expandable knowledge base that help in everyday production. Based on this knowledge, we have further developed our first approaches of guided maintenance scenarios with Microsoft HoloLens, and are therefore now able to present the first demo version of the new ViCI Virtual Communication Interface for the ViCON.
Further developments are continuously being made in software engineering and in the hardware components. Topics dealt with today's and tomorrow's developers are data collection by means of sensors, using digital components such as EC fan motors and other intelligent measurement procedures for implementing "Predictive Maintenance". Conventional mechanical engineering as we know it from the past will change – there is no getting around it.
Get ready for the "Next Generation" in mechanical engineering!
Rehm will be showcasing the following equipment and tools at SMT 2018:
VisionXP+:Our best-in-class system for reflow convection soldering with or without a vacuum is now even more efficient! At SMT we will present the highlights of further development of the VisionXP+, for example, the use of new EC fan motors, which not only are quieter and more sustainable, but also enable comprehensive operation data collection, a more effective cooling line and design tweaks.
VisionXC:It is important for any electronics manufacturer to achieve high quality in assembly production, even at low throughput. The compactness of the VisionXC, which brings together all important technological features in the smallest of space, is impressive. The systems of the VisionX series also have ViCON software with new features and a modern user interface.
ViCON: Rehm has developed with ViCON an innovative solution for easy operability and optimal traceability in the VisionX series. The software can, for example, monitor all values that have changed, or collect and statistically evaluate alarms in order to avoid errors and to optimize machine settings.
ViCI: For modern electronics production, concrete support with the help of data glasses, guided maintenance scenarios on tablet or smartphone as well as a comprehensive and expandable knowledge database are the first steps to make everyday production easier.
The ViCI Virtual Communication Interface is based on these approaches. A portal can be used to retrieve asset-related content and to upload own content. The portal solution also enables the individual extension and integration of other systems as well as a corresponding client administration with individual access rights.
Rehm presents the first demo version of this new support solution at the SMT.
CondensoXC:The CondensoXC has a compact structure due to the innovative processing chamber and is high on performance. Thanks to the patented injection principle, exactly the right quantity of Galden®is supplied for optimal profiling. Because of the closed-loop filter system, the medium can be recovered and filtered virtually 100 %. The system is fully suitable for vacuum and has an integrated process recorder – for optimal traceability.
Nexus:The new vacuum soldering oven Nexus is ideal for pore- and flux-free soldering at up to 450 °C free with a variety of process gases. The wet-chemical activation with formic acid is available as an option. It is possible to use lead-free or lead-containing preforms and pastes. Contact soldering is used in advanced packaging and power electronics.
Securo Minus: Rehm has developed the Securo range to analyse the reliability of sensitive electronics under extreme temperatures. Securo Minus is used for reliable cold function tests and checks the suitability of electronic components at winter temperatures among other things. The electronic components are exposed to cold air or nitrogen at low temperatures of up to –55 °C in the system.
Protecto: Our Protecto for selective conformal coating protects sensitive electronic assemblies from damage by corrosion or other environmental influences such as humidity, chemicals or dust. We will be presenting a variety of system options for different application areas and manufacturing environments at the exhibition. They all have absolutely reliable and accurate coating in common – for the best results!
We look forward to meeting you. Come and visit us in Hall 4A, Booth 100.
About Rehm Thermal System
As a specialist in the field of thermal system solutions for the electronics and photovoltaics industries, Rehm is a technology and innovation leader in the modern and economical production of electronic modules. As a globally operating manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for the metallization of solar cells as well as numerous customer-specific special systems, we are represented in all relevant growth markets and, as a partner with more than 25 years of industry experience, we implement innovative manufacturing solutions that set standards.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Winner of The Science Show Rakett 69 Receives Incap Scholarship
04/24/2024 | IncapThe winner of the Rakett 69 science show, Andri Türkson, who stood out as an electronics enthusiast, received a scholarship from Incap Estonia, along with an internship opportunity in Saaremaa.
Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610
04/24/2024 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) requalification to Alternative Manufacturing Inc (AMI).
Boeing's Janene Stinson Earns IPC Excellence in Education Award at IPC APEX EXPO 2024
04/22/2024 | IPCThe IPC Excellence in Education award was presented to Janene Stinson, Boeing, at IPC APEX EXPO 2024 in Anaheim, California, in recognition of her significant contributions to workforce development and leadership.