BTU to Demo PYRAMAX and Profile Guardian at SMT Hybrid Packaging 2018


Reading time ( words)

BTU International Inc. will exhibit in their distributor's booth (EPP Electronic Production Partners GmbH, Hall 4, Stand 551),  at the upcoming SMT/Hybrid/Packaging show, scheduled to take place June 5-7 at the Messe in Nuremberg, Germany. The company will showcase the award-winning Profile Guardian Redundant Process Monitor and PYRAMAX 100A Reflow Oven.

Profile Guardian pairs a thermocouple probe at product height with software to monitor temperature deviation from baseline – independent from control TCs. The redundant process monitor is aware of oven state (recipe change, energy savings modes, etc.), and monitor data can be included in host communications (MES) from the oven. Additionally, it provides board level traceability when paired with bar code readers, which is a requirement for many large OEM/EMS customers.  

The PYRAMAX 100A features 100" of heated length and eight zones, 350ºC maximum temperature, flexible platform configuration, low power consumption, and a comprehensive menu of options. In addition, the PYRAMAX features BTU’s proprietary WINCON™ control system. WINCON features a simplified user interface and incredibly powerful analytical capabilities. 

About BTU International

BTU International, a wholly-owned subsidiary of Amtech Group, is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, sintering and advanced solar cell processing. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available here

Share

Print


Suggested Items

Most Important Feedback

01/09/2019 | Stephen Las Marias, I-Connect007
In our recent I-Connect007 survey, we asked the following question: “What is the most important feedback that you receive after your board is manufactured?” Here are just a few of the replies, edited slightly for clarity.

Dr. Traian Cucu Discusses Low-Temperature and Lead-Free Soldering

12/14/2018 | Happy Holden, I-Connect007
Dr. Traian Cucu, group leader of the Global Applications and Technologies Expert Group (GATE)—R&D—within Alpha Assembly Solutions, speaks with I-Connect007 Technical Editor Happy Holden about low-temperature and lead-free soldering applications, and the many critical advantages that can achieved by moving to a low-temperature process. They talk about the industry's transition to lead-free, the first, second and third generation of adoption of low-temperature alloys.

Investigation on the Assembly Process for m03015 and a Brief Look at m0201 Components

11/14/2018 | David Geiger, Robert Pennings, and Jane Feng, Flex
Components continue to shrink in the SMT world, and the next evolution of passive components includes m03015 (009005) and m0201 (008004). The m03015 and the m0201 components will see primary adoption in products that require further miniaturization, which would be SiPs. These modules would then be assembled into products through attachment, another assembly, or via other interconnect methods. This article explores the development of an assembly process (SMT only) for the m03015 component.



Copyright © 2019 I-Connect007. All rights reserved.