Indium to Feature AuSn Solder Preforms at IMS 2018


Reading time ( words)

Indium Corporation will feature its precision AuSn solder preforms at International Microwave Symposium (IMS) 2018 from June 10-15 in Philadelphia, Pennsylvania.

Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing. The semiconductor-grade AuSn preforms are designed to meet the challenges facing RF and power semiconductor devices as they continue to get smaller, with increasing power density and power ratings.

Depending on the alloy, gold-based solders have a melting point ranging from 280-1064°C, making it compatible with subsequent reflow processes. In addition, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength.

Indium Corporation’s Pb-free and RoHS-compliant AuSn solder preforms are available in a variety of standard and custom-engineered designs. The Gold Preform Quick Turn Program, offers engineering support from design to production, and can result in a quick turnaround for new design, tool, or prototype quantities.

For more information about Indium Corporation’s AuSn solder preforms, visit  www.indium.com/gold or stop to see us at the show at booth #348.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

Share

Print


Suggested Items

Solder Paste Printing From the Stencil’s Perspective

02/19/2020 | I-Connect007 Editorial Team
Jeff Schake of ASM Assembly Systems discusses the complications surrounding printing and solder paste that he sees from his perspective as a stencil expert.

Blackfox Trains Veterans for Good Manufacturing Jobs

02/18/2020 | Real Time with...IPC
Blackfox Training Institute has been training manufacturing technologists for over 20 years. Based in Longmont, Colorado, Blackfox is now focused on helping veterans of our armed services transition into good jobs in the manufacturing sector. During IPC APEX EXPO 2020, Editor Nolan Johnson spoke with Blackfox CEO Al Dill about the company's veteran training programs, and how this effort is helping companies fill jobs that might otherwise go unfilled.

Solder in PCBA: Can’t Live Without It... or Can We?

02/17/2020 | Joe Fjelstad, Verdant Electronics
For most of its historical use in electronics, the solder alloy of choice was tin-lead, either an Sn60/Pb40 alloy or the Sn63/ Pb37 eutectic version of the tin-lead alloy. These two alloys were the workhorses of the industry. They were both well understood in terms of their processing and reliability—that is, until the advent of lead-free, a well-meaning but ill-conceived and poorly executed conversion, forced on the industry by the European Union in 2006.



Copyright © 2020 I-Connect007. All rights reserved.