RTW IPC APEX EXPO: Indium's Brook Sandy-Smith on PMI-Squared


Reading time ( words)

Indium Corporation's Brook Sandy-Smith, technical support engineer for PCB assembly materials, discusses with I-Connect007 Technical Editor Pete Starkey the ionic process residues on PCB assemblies and introduces the concept of "PMI-squared" (process material interaction investigation), the topic of an IPC Technical Buzz Session at IPC APEX EXPO 2018.

She also discusses the latest developments regarding ROSE testing, and new criteria to measure the cleanliness of cleaned assemblies.

Watch the interview here.

Share


Suggested Items

SMTAI 2018 Closes on a High Note

10/18/2018 | Barry Matties, I-Connect007
SMTA International 2018, which took place in Rosemont, Illinois is now in the history books. This multi-day event, held October 14-18, at the Donald E. Stephens Convention Center, was packed with keynotes, conferences, lively discussions, committee meetings and a two-day exhibition.

IoT: Driving Change in Manufacturing

10/15/2018 | Stephen Las Marias, I-Connect007
In the manufacturing world, the Internet of Things (IoT) can be seen as an element of Industry 4.0. The idea behind it is that factories would evolve to become smarter, to become a lot more flexible—to be able to make the products that customers want, basically at any time that they need.

Mark Curtin on Large-Board Stencil Printing and Metal Squeegees

09/24/2018 | Stephen Las Marias, I-Connect007
Transition Automation Inc. recently developed a large-area benchtop stencil printer targeted for high-mix low- or medium-volume production. In an interview with I-Connect007, Mark Curtin talks about the new system, and why metal squeegees are the way to go when it comes to solder paste printing.



Copyright © 2018 I-Connect007. All rights reserved.