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Almost 70% of PCB assembly defects come from the solder paste printing process. The stencil is a key factor in this process because its tolerances and apertures affect the paste transfer efficiency, which in turn is among the main cause of failures down the line. In this interview, Michael Zahn, development manager for Christian Koenen GmbH, explains how stencil technologies can improve this process and ensure first pass yields.
Watch the interview here.
Mark Laing, Siemens Digital Industries Software
New product introductions (NPIs) and customization have been increasing rapidly over the past few years—with the results that the already-small profit margins in electronics assembly are shrinking even further. Fifteen years ago, the PCB was the product. Today, most products are a system, with multiple PCBs, cables, and enclosures. Many manufacturers want to provide turn-key products that have multiple BOMs, making the assembly process even more complicated.
Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.
Nolan Johnson, I-Connect007
Nolan Johnson recently spoke with Tuan Tran, director of customer solutions at Green Circuits, about what makes a successful process engineer. They also discuss a typical day in the life of a process engineer—from pre-manufacturing through post-DFM, for process improvement. As Tuan points out, there are a variety of paths to becoming a great process engineer.