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Almost 70% of PCB assembly defects come from the solder paste printing process. The stencil is a key factor in this process because its tolerances and apertures affect the paste transfer efficiency, which in turn is among the main cause of failures down the line. In this interview, Michael Zahn, development manager for Christian Koenen GmbH, explains how stencil technologies can improve this process and ensure first pass yields.
Watch the interview here.
Barry Matties, I-Connect007
Stefan Theil, product manager at Factronix, discusses the growing need for cleaning in European electronics manufacturing and the demands he's facing from customers when it comes to finer pitches, automation, and environmental concerns.
T. O’Neill, C. Tafoya, and G. Ramirez, AIM Metals and Alloys
Building upon an earlier study that focused on solder paste powder size, room-temperature aging and PCB pad and aperture designs, this study continues to investigate powder mesh size, but also examines stencil surface treatments and stencil foil tension.
By A. Lifton, P. Salerno, J. Sidone and O. Khaselev, Alpha Assembly Solutions
Shrinking QFN package sizes and power requirements are driving new developments in micro-fluxed preform. Learn what factors contribute to an optimal solution.