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Almost 70% of PCB assembly defects come from the solder paste printing process. The stencil is a key factor in this process because its tolerances and apertures affect the paste transfer efficiency, which in turn is among the main cause of failures down the line. In this interview, Michael Zahn, development manager for Christian Koenen GmbH, explains how stencil technologies can improve this process and ensure first pass yields.
Watch the interview here.
Jade Bridges, Electrolube
Selecting a thermal management material that is broadly applicable to a particular electronic assembly and its predicted operating conditions is a good starting point; however, as with many of these things, the devil is very much in the details! Find out the key considerations in choosing your materials.
Stephen Las Marias, I-Connect007
Transition Automation Inc. recently developed a large-area benchtop stencil printer targeted for high-mix low- or medium-volume production. In an interview with I-Connect007, Mark Curtin talks about the new system, and why metal squeegees are the way to go when it comes to solder paste printing.
Russell Poppe, JJS Manufacturing
Much has been written about the increasing shortages of electronic components such as MLCCs, chip resistors and other semiconductor devices. And the manufacturing industry is now seeing price increases and greatly extended lead times. It seems the situation is likely to get rapidly worse rather than better. What can we do? Read on.