Balver Zinn Group to Exhibit a Host of Solder Materials at SMT Hybrid Packaging 2018


Reading time ( words)

The Balver Zinn Group announces that it will exhibit in Hall 4, Booth #231 at SMT Hybrid Packaging scheduled to take place June 5-7 in Nuremberg, Germany. The Balver Zinn Group will highlight the company’s latest products, technologies and services.

The Balver Zinn Group introduces 390-RX-HT+ a VOC flux with an organic activation system. The 390-RX-HT+ is a high reliability No-Clean flux for various soldering applications classified as ORL0 according IPC J-STD-004. This flux with high SIR values offers superior wetting performance with clear and dry residues.

Among the innovative technologies at the show will be Cobar’s extensive range of wave soldering and selective soldering fluxes:

  • 94-SEL a high reliability Low-VOC selective soldering flux shows excellent soldering performance and is qualified by high-tech and automotive companies in the electronics industry
  • 385-SEL a high-reliability selective flux designed specifically for selective soldering processes with short pre-heat and is besides that ideal for touch up applications
  • 95-RXN-M is a Low-VOC flux with a low solid content designed to eliminate solder balling and leaves a very low level of shiny, dry residues, preferable application in Nitrogen tunnel machine
  • 396-DRX-M+ is a VOC-free environmental friendly flux that exhibits powerful soldering performance combined with extremely low residues

Balver Zinn is a pioneer in lead free solders and as exclusive licensee we present Nihon Superiors new patented SN100CV lead-free micro-alloyed solder. The industry standard SN100C® has been improved by the addition of bismuth which has positive effects on the reliability of the solder joints. The SN100CV® alloy offers high reliable solder joints which are recommended for high-end and automotive electronics.

The upcoming SMT trade show in Nuremberg is the German platform to discover Cobar’s wide range of lead-free and leaded solder paste alloys including low melting solder paste formulations.

About Balver Zinn Group

Headquartered in Germany, the Balver Zinn Group has facilities in the United States, Europe and distributors in all major areas of the world. Balver Zinn – Cobar product range includes: solder bar, solder wire, solder flux, gel flux, cleaner, solder paste and miscellaneous service and soldering products. For information about the company’s complete range of solder materials, click here.

Share

Print


Suggested Items

The Convergence: IPC Merging CFX With IPC-2581

09/15/2019 | Andy Shaughnessy, I-Connect007
Gary Carter of XPLM and Michael Ford of Aegis Software are heading a group tasked with combining the IPC-2581 standard, now referred to as Digital Product Model Exchange (DPMX), with IPC’s Connected Factory Exchange (CFX). In this interview, they discuss the benefits that can be expected when these standards are fully merged for both PCB designers and process engineers on the manufacturing floor.

To Improve the Standards Process, Get Involved

09/13/2019 | I-Connect007 Editorial Team
Jan Pedersen, senior technical advisor at Elmatica, and Ray Prasad, president of Ray Prasad Consultancy Group, spoke with the I-Connect007 team about the current state of PCB standards and where the process might need improvements, including the many difficulties around transparency, slow updates, limitless numbers of variations, and a variety of other topics.

PCB Design Training: More Critical Than Ever

09/05/2019 | Andy Shaughnessy, Design007 Magazine
I interviewed Gary Ferrari of FTG at the IPC High-Reliability Forum and Microvia Summit in Baltimore. Gary is a co-founder of the IPC Designers Council and a longtime advocate for PCB design and PCB designers. We discussed the crucial role that PCB designers play in the entire electronics development process, and how IPC and the Designers Council are helping to educate and inform the next generation of designers.



Copyright © 2019 I-Connect007. All rights reserved.