Indium's Brook Sandy-Smith to Moderate Two Panels at ICEET 2018


Reading time ( words)

Indium Corporation's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will moderate two expert panels at the International Conference for Electronics Enabling Technologies (ICEET), which will be held from June 5-7 in Markham, Ontario, Canada.

Sandy-Smith will moderate the "Warpage Induced Defects and Component Warpage Limits" panel. This panel features professionals from Plexus, Rockwell Collins, and Akrometrix.

Sandy-Smith will also moderate the "Low-Melting Point Solder Pastes" panel. Panelists will include Indium Dr. HongWen Zhang, Research Metallurgist, along with professionals from Alpha Assembly Solutions and Nihon Superior.

Sandy-Smith will also present "Process and Materials Interaction Investigation: Or How to Measure Post-Process Assembly Surface Reliability".

Sandy-Smith is an industry leader renowned for her technical knowledge and support. As a Technical Support Engineer based at Indium Corporation’s headquarters in Clinton, NY, she specializes in PCB Assembly Materials and works closely with customers to develop custom solutions and optimize their processes. Sandy-Smith has a passion for developing and implementing standardization for test methods and is an SMTA Certified Process Engineer. She is active in several IPC committees, SMTA programs, and iNEMI projects, and currently serves as Chair of the J-004 committee and as Vice President of technical programs for the SMTA Empire chapter. She graduated from the International Engineering Program at the University of Rhode Island with a degree in chemical engineering and German language.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

Share


Suggested Items

How DFA Converts Complexity into Freedom for Medical Device Development

08/02/2018 | Craig Stott, Ed Sermanoukian, and Girish Wable, Nypro
The assembly of medical devices comprising electronic and mechanical components has become an increasing challenge as devices grow more complex, functional and compact, and as they undergo increasingly frequent product refresh cycles. Read on to find assembly techniques that will help manufacturers to deliver highly engineered and integrated products.

Conversation with Miraco… Strategies for Successful Flex Circuit Assembly

07/11/2018 | Stephen Las Marias, I-Connect007
Jason Michaud, a 19-year veteran at Miraco Inc., is the company’s new vice president of sales. In an interview with SMT007 Magazine, Jason speaks about the factors driving the increasing utilization of flexible printed circuits, the challenges in flex circuit assembly, and the best practices to address those issues.

The Value of Site Visits in Selecting Your Electronics Manufacturer

06/29/2018 | Neil Sharp, JJS Manufacturing
A site visit can be an invaluable exercise in helping you to better understand your electronics manufacturing services (EMS) outsourcing options and to see first-hand the operational capability, procedures and culture of a prospective EMS partner.



Copyright © 2018 I-Connect007. All rights reserved.