AIM to Participate at International Microwave Symposium


Reading time ( words)

AIM will highlight their full range of specialty joining materials at the International Microwave Symposium, scheduled to take place June 12-14, 2018 at the Pennsylvania Convention Center in Philadelphia, Pennsylvania. AIM will be located in booth #1057.

AIM’s full range of specialty joining materials includes indium and gold/tin solders for assembly and a wide variety of indium alloys for various applications. AIM’s Specialty Division offers solders for fiber to ferrule soldering, laser die attach, hermetic packaging and sealing, thermal management, and numerous other applications.

“We are looking forward to participating at this year’s IMS event,” said Brian O’Neill, AIM’s Specialty Materials Manager. “We are anticipating a great show and countless opportunities to connect and provide support to prospective and current AIM customers in the area.”

To discover all of the products AIM’s Specialty Division offers, including indium and lead-free solders, visit the company at booth #1057, June 12-14.

About AIM Specialty Division

AIM manufactures and supplies solder and braze materials for the electronic, microwave, semiconductor, LED, and photonic industries. Our innovative products and technical support helps our customers to achieve the highest quality and yields in their production processes. For more information about AIM Specialty Materials, please click here.

Share

Print


Suggested Items

Real Time with…SMTAI 2020: KYZEN on How Maximized Stencil Life Improves Yields

09/16/2020 | Real Time with...SMTAI
KYZEN Executive Vice President Tom Forsythe shares company updates on stencil cleaning with Nolan Johnson. KYZEN recently announced its newest stencil cleaning product—KYZEN E5631. Forsythe details how the product is best used, as well as the benefits it brings to maximizing stencil life and improving manufacturing yields.

Just Ask Eric: Selecting the Right Lead-Free Solder for Your Application

09/15/2020 | I-Connect007 Editorial Team
First, we asked you to send in your questions for Happy Holden and Joe Fjelstad in our “Just Ask” series. Now, it’s Eric Camden’s turn! A regular SMT007 columnist, Eric is a lead investigator at Foresite Inc., an analytical testing and consulting laboratory. As a reliability expert, Eric has worked with many large OEMs and contract manufacturing companies to optimize their manufacturing processes and assist with the identification of electronic hardware failures utilizing various analytical techniques. He also specializes in optimizing PCBA processes and identifying hardware failures through analysis. We hope you enjoy “Just Ask Eric.”

Just Ask Joe: The Occam Process

08/25/2020 | I-Connect007 Editorial Team
First, we asked you to send in your questions for Happy Holden. Now, it’s Joe Fjelstad’s turn! Inventor, columnist, instructor, and founder of Verdant Electronics, Joe has been involved with rigid PCBs and flexible circuits for decades, and he’s ready to share some of his knowledge with our readers. We hope you enjoy “Just Ask Joe.”



Copyright © 2020 I-Connect007. All rights reserved.