Nordson DIMA to Exhibit at SMT Hybrid 2018


Reading time ( words)

Nordson DIMA, a division of Nordson Corporation, will exhibit a range of products for hot bar soldering, as well as fluid dispensing and coating systems, at SMT Hybrid 2018 in Nuremberg, Germany, June 5-7, 2018, in the AAT Aston GmbH stand, Hall 4, booth 241.

Demonstrations will include Nordson DIMA's C-TurnFlux, an automated stand-alone hot bar system that combines flux dispensing with hot bar reflow soldering for applications where process automation, production output, and product quality inspection are required. A motorized, five-position indexer offers high-speed product handling and guaranteed position repeatability. Another system, the C-slide, is ideal for all kinds of applications using Anisotropic Conductive Film (ACF) final or heat-seal bonding, hot bar reflow soldering, and heat staking processes to produce LCD, flex foil, and PCB interconnections. A third demonstrated hot bar product will be the C-Tack Desktop System, which is especially designed for ACF laminating in pre-tacking or pre-bond applications. ACF bonding is a hot bar technique to make electrical connections between flexible to rigid circuit boards, flex to glass panel displays, and flex to flex. All systems use pneumatic bonding head technology and offer reliable and closed-loop process data storage and an integrated, constant-heat or pulsed power supply.

Also on display will be DIMA dispensing and coating systems that are supplied exclusively to the European market. Two coating systems will be showcased: the desktop module DispenseMaster and the inline coater Elite DR-071. The Elite platform can now be equipped with different cover plates and a cabinet door designed for easier maintenance.

About Nordson DIMA 

Nordson DIMA serves the global market with hot bar bonding and soldering application solutions and offers a range of dispensing and coating products exclusively for the European region. The customer-inspired systems support a range of different industries, like electronics, automotive, medical, aerospace, defense, and solar/energy. The company offers a wide variety of solutions, ranging from high quality standard systems and process equipment to completely automated production lines; from concept discussions to global installation and production ramp up. For more information click here.

About Nordson Corporation

Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing of adhesives, coatings, sealants, biomaterials, polymers, plastics and other materials, fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service.  Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 35 countries. For more information, click here.

Share

Print


Suggested Items

'Coatings Uncoated!' Webinar Series and Automotive Industry Trends

04/03/2020 | Real Time with...IPC
Phil Kinner, global business/technical director of Electrolube’s coatings division, tells Pete Starkey about the positive impact of the “Coatings Uncoated!” webinar series and comments on how the company has responded to the changes in the focus of the automotive industry.

Trends From the Show: Solder and Software

03/18/2020 | Nolan Johnson, I-Connect007
In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.

Evolving Solder Capabilities for Shrinking Components

03/16/2020 | I-Connect007 Editorial Team
Taiyo’s Yuya Suzuki, marketing manager for IC packaging materials, talks with Nolan Johnson and Dan Feinberg about the challenges with soldering due to shrinking components and how Taiyo’s R&D work around smaller filler sizes and increased planarity has been preparing them for the future of solder mask.



Copyright © 2020 I-Connect007. All rights reserved.