Goepel electronic Improves Inspection of Solder Pastes, DCB Substrates


Reading time ( words)

Goepel electronic has upgraded the inline inspection system SPI Line · 3D. In addition to 3D solder paste inspection, the SPI Line · 3D now has new features for testing sinter pastes and direct copper bonded (DCB) substrates.

Due to the high precision of the system in conjunction with the new functions, process errors in sinter paste printing can now also be detected. Even the smallest defect structures such as voids and particles with heights below 20 µm can be detected with reproducible results. In addition, the system is now able to inspect DCB substrates. For example, air pockets (voids) on DCB structures can be reliably measured from a height of 10 µm. This makes the SPI Line · 3D the only SPI system currently available on the market that can be used for both traditional solder paste inspection with typical solder paste heights of 80 µm to 150 µm and for the newer applications of sinter paste and DCB testing with significantly lower structural heights.

The system software PILOT SPI provides the user with simple and intuitive test program creation. The operation is possible via touchscreen. Complete test programs can be created in less than 10 minutes.

The PILOT Connect software module connects the system with other inspection systems. This common interface for SPI, AOI and AXI centrally captures and manages all inspection data as well as the machine and operating data of the connected systems. It also allows bidirectional communication to higher level MES and traceability systems.

Furthermore, all inspection information can be merged on a central verification and repair station, combining data to create the safest and most dependable fault assessment environment available along with completely new possibilities for optimizing the production process.

Share

Print


Suggested Items

The Convergence of 5G and Automotive

01/08/2020 | Barry Matties, I-Connect007
Karthik Vijay is head of the applications engineering team for customers in Europe at Indium Corporation. He spoke with Barry Matties about what EMS or assemblers for automotive should consider, as well as how he thinks 5G will affect the marketplace and manufacturing.

SMTA 2019 International Awards

09/30/2019 | Nolan Johnson, I-Connect007
The SMTA International conference—held September 22–29, 2019, at the Stephens Convention Center in Rosemont, Illinois—honored industry members with awards for their contributions to the industry. I-Connect007 has compiled an unofficial list of award recipients. The official list from SMTA will be released shortly, and I-Connect007 will publish it as soon as it is available.

Comparing Soldering Results of ENIG and EPIG Post-steam Exposure

09/11/2019 | Jon Bengston and Richard DePoto, Uyemura International USA
Electroless nickel immersion gold (ENIG) is now a well-regarded finish used to enhance and preserve the solderability of copper circuits. Electroless palladium immersion gold (EPIG), meanwhile, is a new surface finish also for enhancing and preserving solderability—but with the advantage of eliminating electroless nickel from the deposit layer. This feature has become increasingly important with the increasing use of high-frequency PCB designs whereby nickel’s magnetic properties are detrimental.



Copyright © 2020 I-Connect007. All rights reserved.