Virtual Industries to Exhibit Small Part Handling Tools at SEMICON West


Reading time ( words)

Virtual Industries Inc. will be demonstrating its ADJUST-A-VAC ESD Safe Kit and STEALTH-WAND ELITE Kit at SEMICON West, scheduled to take place July 10-12, 2018 at the Moscone Center in San Francisco, California. Virtual Industries in Booth 924.

The ADJUST-A-VAC ESD Safe Kit allows the operator to adjust the vacuum level from just below atmospheric pressure to up to ten inches of mercury, depending on the fragility of the part being handled. The vacuum tweezer system was developed as a result of customer concerns about manual handling of very thin/delicate substrates, wafers, MEMS devices and other very fragile components. An integrated ten segment bar-graph-display shows the vacuum level present during handling operations. 

Virtual2.jpgThe STEALTH-WAND ELITE Kit operates directly on 30 to 50 psi compressed air or nitrogen. The normally closed Stealth-Vac Elite vacuum pen contains a whisper quiet venturi vacuum generator that is activated only when the control button is depressed. This helps conserve factory compressed air when the tool is not in use. 

About Virtual Industries Inc.

Founded in 1987, Virtual Industries Inc. is headquartered in Colorado Springs, Colo. For more than 20 years, Virtual Industries has been a leading supplier of manual vacuum handling solutions to the world’s high-technology firms. The company’s patented ESD-safe products are used by CLASS I clean room personnel, electronics assemblers, semiconductor manufacturers, Universities and scientists globally. Virtual Industries’ success has come from developing innovative manual vacuum handling tools and pick-up tips based on customer requests and customer feed back. These tools provide customer specific solutions that make assembly and processing operations more productive and ergonomic. For more information, click here.

Share


Suggested Items

Rework and Reball Challenges for Wafer Level Packages

10/16/2017 | Lauren Cummings and Priyanka Dobriyal, Ph.D., Intel Corp.
Amid the growing trend in package and PCB miniaturization, wafer-level packages (WLPs) have garnered recent popularity for their affordable cost, small footprint, and thin profile. Component suppliers must be prepared to support failure analysis for PCB-assembled WLPs, including fault isolation, nondestructive screening, as well as destructive analysis techniques.

RTW SMTAI: MIRTEC on Staying Ahead of the Curve

09/21/2017 | Real Time with...SMTAI
Brian D’Amico, president of MIRTEC, talks with I-Connect007 Managing Editor Andy Shaughnessy about some of the latest 3D AOI challenges, including dealing with highly reflective surfaces of solder joints or wafer-level die, which make it impossible to characterize in 3D. He says it's not just plain SMT boards anymore, but an integration of wafer-level manufacturing, which they see as coming down more and more.

Industry 4.0: Implications for the Asia Pacific Manufacturing Industry

11/09/2015 | Krishnan Ramanathan, FroST & SulliVAN
Industry 4.0 refers to a new level of organization and control of the entire value chain, across the life cycle of products. Seen as the fourth industrial revolution, Industry 4.0 seeks to merge physical and virtual worlds. This marks a significant change in the level of complexity from the third industrial revolution, where electronics and information technology were used to automate production.



Copyright © 2018 I-Connect007. All rights reserved.