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AIM Solder is exhibiting at the SMTA Upper Midwest Expo & Tech Forum today, June 14, 2018, at the Double Tree by Hilton in Park Place, Minneapolis, Minnessota. AIM will highlight their revolutionary REL61 and REL22 lead-free solder alloys, along with their full line of solder assembly materials.
AIM’s new alloys provide the PCB assembly industry with unique solutions to address the limitations of current industry offerings. REL22 is an award-winning, high reliability alloy with durability characteristics that double that of SAC305 in harsh environments. REL61 is a low-silver solder alloy that solves the process challenges associated with many other low/no-silver solder alloys. With a 10°C lower melting temperature and superior wetting performance, REL61 can lower process temperatures, prevent PCB damage, and reduce waste. AIM’s REL alloys are available in paste, wire and bar formats and are engineered for reliability, usability, and cost effectiveness.
Along with their REL products, AIM will showcase its full line of advanced solder materials, including its solder pastes, liquid fluxes, tin/lead and lead-free alloys. To see all of AIM’s products and services, visit the company at the SMTA Upper Midwest Expo & Tech Forum for more information and to speak with one of AIM’s knowledgeable staff members.
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